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EDJ2104BASE PDF预览

EDJ2104BASE

更新时间: 2024-11-28 11:45:07
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率
页数 文件大小 规格书
148页 1780K
描述
2G bits DDR3 SDRAM

EDJ2104BASE 数据手册

 浏览型号EDJ2104BASE的Datasheet PDF文件第2页浏览型号EDJ2104BASE的Datasheet PDF文件第3页浏览型号EDJ2104BASE的Datasheet PDF文件第4页浏览型号EDJ2104BASE的Datasheet PDF文件第5页浏览型号EDJ2104BASE的Datasheet PDF文件第6页浏览型号EDJ2104BASE的Datasheet PDF文件第7页 
PRELIMINARY DATA SHEET  
2G bits DDR3 SDRAM  
EDJ2104BASE (512M words × 4 bits)  
EDJ2108BASE (256M words × 8 bits)  
Features  
Specifications  
Density: 2G bits  
Organization  
64M words × 4 bits × 8 banks (EDJ2104BASE)  
32M words × 8 bits × 8 banks (EDJ2108BASE)  
Package  
Double-data-rate architecture; two data transfers per  
clock cycle  
The high-speed data transfer is realized by the 8 bits  
prefetch pipelined architecture  
Bi-directional differential data strobe (DQS and /DQS)  
is transmitted/received with data for capturing data at  
the receiver  
78-ball FBGA  
Lead-free (RoHS compliant) and Halogen-free  
Power supply: VDD, VDDQ = 1.5V ± 0.075V  
Data rate  
DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
1600Mbps/1333Mbps/1066Mbps/800Mbps (max.)  
1KB page size  
transitions  
Commands entered on each positive CK edge; data  
Row address: A0 to A14  
and data mask referenced to both edges of DQS  
Column address: A0 to A9, A11 (EDJ2104BASE)  
Data mask (DM) for write data  
A0 to A9 (EDJ2108BASE)  
Posted /CAS by programmable additive latency for  
Eight internal banks for concurrent operation  
Interface: SSTL_15  
Burst lengths (BL): 8 and 4 with Burst Chop (BC)  
Burst type (BT):  
Sequential (8, 4 with BC)  
Interleave (8, 4 with BC)  
/CAS Latency (CL): 6, 7, 8, 9, 10, 11  
/CAS Write Latency (CWL): 5, 6, 7, 8  
better command and data bus efficiency  
On-Die Termination (ODT) for better signal quality  
Synchronous ODT  
Dynamic ODT  
Asynchronous ODT  
Multi Purpose Register (MPR) for temperature read  
out  
ZQ calibration for DQ drive and ODT  
Programmable Partial Array Self-Refresh (PASR)  
Precharge: auto precharge option for each burst  
access  
/RESET pin for Power-up sequence and reset  
Driver strength: RZQ/7, RZQ/6 (RZQ = 240)  
Refresh: auto-refresh, self-refresh  
Refresh cycles  
function  
SRT range:  
Normal/extended  
Programmable Output driver impedance control  
Average refresh period  
7.8µs at 0°C TC ≤ +85°C  
3.9µs at +85°C < TC ≤ +95°C  
Operating case temperature range  
TC = 0°C to +95°C  
Document No. E1505E20 (Ver. 2.0)  
Date Published November 2009 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2009  

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