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DS1650AB-100-IND PDF预览

DS1650AB-100-IND

更新时间: 2024-11-29 20:32:23
品牌 Logo 应用领域
达拉斯 - DALLAS 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
12页 96K
描述
Non-Volatile SRAM Module, 512KX8, 100ns, CMOS,

DS1650AB-100-IND 技术参数

是否Rohs认证:不符合生命周期:Transferred
Reach Compliance Code:unknown风险等级:5.82
Is Samacsys:N最长访问时间:100 ns
其他特性:10 YEAR DATA RETENTIONJESD-30 代码:R-XDIP-P32
JESD-609代码:e0内存密度:4194304 bit
内存集成电路类型:NON-VOLATILE SRAM MODULE内存宽度:8
功能数量:1端子数量:32
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX8
封装主体材料:UNSPECIFIED封装代码:DIP
封装等效代码:DIP32,.6封装形状:RECTANGULAR
封装形式:IN-LINE并行/串行:PARALLEL
电源:5 V认证状态:Not Qualified
最大待机电流:0.005 A子类别:SRAMs
最大压摆率:0.085 mA最大供电电压 (Vsup):5.25 V
最小供电电压 (Vsup):4.75 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:PIN/PEG端子节距:2.54 mm
端子位置:DUALBase Number Matches:1

DS1650AB-100-IND 数据手册

 浏览型号DS1650AB-100-IND的Datasheet PDF文件第2页浏览型号DS1650AB-100-IND的Datasheet PDF文件第3页浏览型号DS1650AB-100-IND的Datasheet PDF文件第4页浏览型号DS1650AB-100-IND的Datasheet PDF文件第5页浏览型号DS1650AB-100-IND的Datasheet PDF文件第6页浏览型号DS1650AB-100-IND的Datasheet PDF文件第7页 
DS1650Y/AB  
DS1650Y/AB  
Partitionable 4096K NV SRAM  
FEATURES  
PIN ASSIGNMENT  
10 years minimum data retention in the absence of  
A18  
A16  
A14  
A12  
A7  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
V
CC  
external power  
2
A15  
A17  
WE  
A13  
A8  
Data is automatically protected during power loss  
Directly replaces 512K x 8 volatile static RAM  
3
4
5
Write protects selected blocks of memory when pro-  
grammed  
A6  
6
A5  
7
A9  
Unlimited write cycles  
A4  
8
A11  
OE  
A3  
9
Low-power CMOS  
A2  
10  
11  
12  
13  
14  
15  
16  
A10  
CE  
Read and write access times as fast as 70 ns  
A1  
A0  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
Lithium energy source is electrically disconnected to  
retainfreshness until power is applied for the firsttime  
DQ0  
DQ1  
DQ2  
GND  
Full +10% V operating range (DS1650Y)  
CC  
Optional +5% V operating range (DS1650AB)  
CC  
32-PIN ENCAPSULATED PACKAGE  
740 MIL EXTENDED  
o
Optional industrial temperature range of -40 C to  
o
+85 C, designated IND  
JEDEC standard 32-pin DIP package  
Low Profile Module (LPM) package  
NC  
A15  
A16  
PFO  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
A18  
A17  
A14  
A13  
A12  
A11  
A10  
A9  
A8  
A7  
A6  
A5  
Fits into standard 68–pin PLCC surface mount-  
able socket  
V
CC  
WE  
OE  
CE  
255 mils package height  
Power Fail Output (PFO) warns system of  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ2  
DQ1  
DQ0  
GND  
impending V power failure  
CC  
A4  
A3  
A2  
A1  
A0  
34–PIN LOW PROFILE MODULE (LPM)  
ECopyright 1995 by Dallas Semiconductor Corporation.  
All Rights Reserved. For important information regarding  
patents and other intellectual property rights, please refer to  
Dallas Semiconductor data books.  
100495 1/12  

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