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CY7C1429KV18 PDF预览

CY7C1429KV18

更新时间: 2024-12-01 09:44:35
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
32页 909K
描述
36-Mbit DDR II SIO SRAM 2-Word Burst Architecture

CY7C1429KV18 数据手册

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CY7C1422KV18, CY7C1429KV18  
CY7C1423KV18, CY7C1424KV18  
36-Mbit DDR II SIO SRAM 2-Word  
Burst Architecture  
36-Mbit DDR II SIO SRAM 2-Word Burst Architecture  
Features  
Configurations  
36 Mbit density (4 M × 8, 4 M × 9, 2 M × 18, 1 M × 36)  
333 MHz clock for high bandwidth  
CY7C1422KV18 – 4 M × 8  
CY7C1429KV18 – 4 M × 9  
CY7C1423KV18 – 2 M × 18  
CY7C1424KV18 – 1 M × 36  
2-word burst for reducing address bus frequency  
Double data rate (DDR) interfaces  
(data transferred at 666 MHz) at 333 MHz  
Functional Description  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
The CY7C1422KV18, CY7C1429KV18, CY7C1423KV18, and  
CY7C1424KV18 are 1.8 V synchronous pipelined SRAMs,  
equipped with DDR II SIO (double data rate separate I/O)  
architecture. The DDR II SIO consists of two separate ports: the  
read port and the write port to access the memory array. The  
read port has data outputs to support read operations and the  
write port has data inputs to support write operations. The DDR II  
SIO has separate data inputs and data outputs to completely  
eliminate the need to “turnaround” the data bus required with  
common I/O devices. Access to each port is accomplished  
through a common address bus. Addresses for read and write  
are latched on alternate rising edges of the input (K) clock. Write  
data is registered on the rising edges of both K and K. Read data  
is driven on the rising edges of C and C if provided, or on the  
rising edge of K and K if C/C are not provided. Each address  
location is associated with two 8-bit words in the case of  
CY7C1422KV18, two 9-bit words in the case of  
CY7C1429KV18, two 18-bit words in the case of  
CY7C1423KV18, and two 36-bit words in the case of  
CY7C1424KV18 that burst sequentially into or out of the device.  
Two input clocks for output data (C and C) to minimize clock  
skew and flight time mismatches  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Synchronous internally self timed writes  
DDR II operates with 1.5 cycle read latency when DOFF is  
asserted HIGH  
Operatessimilarto DDR Idevice with 1 cycle read latencywhen  
DOFF is asserted LOW  
1.8 V core power supply with HSTL inputs and outputs  
Variable drive HSTL output buffers  
Expanded HSTL output voltage (1.4 V to VDD  
)
Supports both 1.5 V and 1.8 V IO supply  
Available in 165-ball FBGA package (13 × 15 × 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs are tightly matched to the  
two output echo clocks CQ/CQ, eliminating the need to capture  
data separately from each individual DDR II SIO SRAM in the  
system design. Output data clocks (C/C) enable maximum  
system clocking and data synchronization flexibility.  
Phase locked loop (PLL) for accurate data placement  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Selection Guide  
Description  
Maximum operating frequency  
Maximum operating current  
333 MHz  
333  
300 MHz  
300  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
× 8  
× 9  
480  
450  
420  
370  
340  
480  
450  
420  
370  
340  
× 18  
× 36  
490  
460  
430  
380  
340  
600  
560  
490  
430  
380  
Cypress Semiconductor Corporation  
Document Number: 001-57829 Rev. *B  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 28, 2011  
[+] Feedback  

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