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CY7C1416BV18-278BZI PDF预览

CY7C1416BV18-278BZI

更新时间: 2024-09-15 05:19:27
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赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
28页 1160K
描述
36-Mbit DDR-II SRAM 2-Word Burst Architecture

CY7C1416BV18-278BZI 数据手册

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CY7C1416BV18  
CY7C1427BV18  
CY7C1418BV18  
CY7C1420BV18  
PRELIMINARY  
36-Mbit DDR-II SRAM 2-Word Burst  
Architecture  
Features  
Functional Description  
• 36-Mbit density (4M x 8, 4M x 9, 2M x 18, 1M x 36)  
• 300-MHz clock for high bandwidth  
The CY7C1416BV18, CY7C1427BV18, CY7C1418BV18 and  
CY7C1420BV18 are 1.8V Synchronous Pipelined SRAM  
equipped with DDR-II architecture. The DDR-II consists of an  
SRAM core with advanced synchronous peripheral circuitry  
and a 1-bit burst counter. Addresses for Read and Write are  
latched on alternate rising edges of the input (K) clock. Write  
data is registered on the rising edges of both K and K. Read  
data is driven on the rising edges of C and C if provided, or on  
the rising edge of K and K if C/C are not provided. Each  
address location is associated with two 8-bit words in the case  
of CY7C1416BV18 and two 9-bit words in the case of  
CY7C1427BV18 that burst sequentially into or out of the  
device. The burst counter always starts with a “0” internally in  
the case of CY7C1416BV18 and CY7C1427BV18. On  
CY7C1418BV18 and CY7C1420BV18, the burst counter  
takes in the least significant bit of the external address and  
bursts two 18-bit words in the case of CY7C1418BV18 and two  
36-bit words in the case of CY7C1420BV18 sequentially into  
or out of the device.  
• 2-Word burst for reducing address bus frequency  
• Double Data Rate (DDR) interfaces  
(data transferred at 600 MHz) @ 300 MHz for DDR-II  
• Two input clocks (K and K) for precise DDR timing  
— SRAM uses rising edges only  
• Two input clocks for output data (C and C) to minimize  
clock-skew and flight-time mismatches  
• Echo clocks (CQ and CQ) simplify data capture in  
high-speed systems  
• Synchronous internally self-timed writes  
• DDR-II operates with 1.5 cycle read latency when DLL  
is enabled  
• Operates like a DDR I device with 1 cycle read latency  
in DLL off mode  
Asynchronous inputs include output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs D) are tightly matched to the  
two output echo clocks CQ/CQ, eliminating the need for  
separately capturing data from each individual DDR SRAM in  
the system design. Output data clocks (C/C) enable maximum  
system clocking and data synchronization flexibility.  
• 1.8V core power supply with HSTL inputs and outputs  
• Variable drive HSTL output buffers  
• Expanded HSTL output voltage (1.4V–VDD  
)
• Available in 165-ball FBGA package (15 x 17 x 1.4 mm)  
• Offered in both in lead-free and non lead-free packages  
• JTAG 1149.1 compatible test access port  
All synchronous inputs pass through input registers controlled  
by the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
• Delay Lock Loop (DLL) for accurate data placement  
Configurations  
CY7C1416BV18 – 4M x 8  
CY7C1427BV18 – 4M x 9  
CY7C1418BV18 – 2M x 18  
CY7C1420BV18 – 1M x 36  
Selection Guide  
300 MHz  
300  
278 MHz  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
Maximum Operating Frequency  
278  
775  
Maximum Operating Current (DDR-II)  
825  
700  
600  
500  
Cypress Semiconductor Corporation  
Document Number: 001-07033 Rev. *B  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 20, 2006  
[+] Feedback  

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