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CY7C1383B-83BGC PDF预览

CY7C1383B-83BGC

更新时间: 2024-11-13 04:01:51
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器时钟
页数 文件大小 规格书
31页 599K
描述
512 】 36/1M 】 18 Flow-Thru SRAM

CY7C1383B-83BGC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
针数:119Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.91Is Samacsys:N
最长访问时间:10 ns其他特性:FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK):83 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
长度:22 mm内存密度:18874368 bit
内存集成电路类型:STANDARD SRAM内存宽度:18
功能数量:1端子数量:119
字数:1048576 words字数代码:1000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA119,7X17,50
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5/3.3,3.3 V认证状态:Not Qualified
座面最大高度:2.4 mm最大待机电流:0.02 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.185 mA最大供电电压 (Vsup):3.63 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

CY7C1383B-83BGC 数据手册

 浏览型号CY7C1383B-83BGC的Datasheet PDF文件第2页浏览型号CY7C1383B-83BGC的Datasheet PDF文件第3页浏览型号CY7C1383B-83BGC的Datasheet PDF文件第4页浏览型号CY7C1383B-83BGC的Datasheet PDF文件第5页浏览型号CY7C1383B-83BGC的Datasheet PDF文件第6页浏览型号CY7C1383B-83BGC的Datasheet PDF文件第7页 
381B  
CY7C1381B  
CY7C1383B  
512 × 36/1M × 18 Flow-Thru SRAM  
internal burst operation. All synchronous inputs are gated by  
registers controlled by a positive-edge-triggered clock input  
(CLK). The synchronous inputs include all addresses, all data  
inputs, address-pipelining Chip Enable (CE), Burst Control  
Inputs (ADSC, ADSP, and ADV), Write Enables (BWa, BWb,  
BWc, BWd, and BWe), and Global Write (GW).  
Features  
Fast access times: 7.5, 8.5, 10.0 ns  
Fast clock speed: 117, 100, 83 MHz  
Provide high-performance 3-1-1-1 access rate  
Optimal for depth expansion  
Asynchronous inputs include the Output Enable (OE) and  
Burst Mode Control (MODE). The data outputs (Q), enabled  
by OE, are also asynchronous.  
3.3V (5% / +10%) power supply  
Common data inputs and data outputs  
Byte Write Enable and Global Write control  
Chip enable for address pipeline  
Address, data and control registers  
Internally self-timed Write Cycle  
Addresses and chip enables are registered with either  
Address Status Processor (ADSP) or address status controller  
(ADSC) input pins. Subsequent burst addresses can be inter-  
nally generated as controlled by the Burst Advance Pin (ADV).  
Burst control pins (interleaved or linear burst  
Address, data inputs, and Write controls are registered on-chip  
to initiate self-timed Write cycle. Write cycles can be one to  
sequence)  
Automatic power down available using ZZ mode or CE  
deselect  
High-density, high-speed packages  
JTAG boundary scan for BGA packaging version  
four bytes wide as controlled by the Write control inputs.  
Individual byte Write allows individual byte to be written. BWa  
controls DQ1-DQ8 and DP1. BWb controls DQ9-DQ16 and  
DP2. BWc controls DQ17-DQ24and DP3. BWd controls  
DQ25-DQ32 and DP4. BWa, BWb BWc, and BWd can be  
active only with BWe being LOW. GW being LOW causes all  
bytes to be written. Write pass-through capability allows  
written data available at the output for the immediately next  
Read cycle. This device also incorporates pipelined enable  
circuit for easy depth expansion without penalizing system  
performance.  
Functional Description  
The Cypress Synchronous Burst SRAM family employs  
high-speed, low power CMOS designs using advanced  
single-layer polysilicon, triple-layer metal technology. Each  
memory cell consists of six transistors.  
The CY7C1381B and CY7C1383B SRAMs integrate  
524,288 × 36 and 1,048,576 × 18 SRAM cells with advanced  
synchronous peripheral circuitry and a 2-bit counter for  
All inputs and outputs of the CY7C1381B and the CY7C1383B  
are JEDEC-standard JESD8-5-compatible.  
Selection Guide  
117 MHz  
100 MHz  
8.5  
83 MHz  
10.0  
185  
Unit  
ns  
Maximum Access Time  
7.5  
250  
20  
Maximum Operating Current  
Maximum CMOS Standby Current  
225  
mA  
mA  
20  
20  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05196 Rev. **  
Revised December 3, 2001  

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