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CY7C1383BV25-100BGI PDF预览

CY7C1383BV25-100BGI

更新时间: 2024-11-14 04:17:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
26页 799K
描述
Standard SRAM, 1MX18, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119

CY7C1383BV25-100BGI 数据手册

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CY7C1383BV25  
CY7C1381BV25  
512K x 36 / 1M x 18 Flow-Thru SRAM  
registers controlled by a positive-edge-triggered Clock Input  
(CLK). The synchronous inputs include all addresses, all data  
inputs, address-pipelining Chip Enable (CE), Burst Control  
Inputs (ADSC, ADSP, and ADV), Write Enables (BWa, BWb,  
BWc, BWd,and BWe), and Global Write (GW).  
Features  
• Fast access times: 7.5, 8.5, 10 ns  
• Fast clock speed: 117, 100, 83 MHz  
• Provide high-performance 2-1-1-1 access rate  
• Optimal for depth expansion  
Asynchronous inputs include the output enable (OE) and burst  
mode control (MODE). The data outputs (Q), enabled by OE,  
are also asynchronous.  
• 2.5V ± 5% power supply  
• Common data inputs and data outputs  
• Byte Write Enable and Global Write control  
• Chip enable for address pipeline  
• Address, data, and control registers  
• Internally self-timed Write Cycle  
Addresses and chip enables are registered with either  
Address Status Processor (ADSP) or Address Status  
Controller (ADSC) input pins. Subsequent burst addresses  
can be internally generated as controlled by the Burst Advance  
Pin (ADV).  
• Burst control pins (interleaved or linear burst  
sequence)  
• Automatic power-down available using ZZ mode or CE  
deselect  
• High-density, high-speed packages  
• JTAG boundary scan for BGA packaging version  
Address, data inputs, and write controls are registered on-chip  
to initiate self-timed WRITE cycle. WRITE cycles can be one  
to four bytes wide as controlled by the write control inputs.  
Individual byte write allows individual byte to be written. BWa  
controls DQ1DQ8 and DP1. BWb controls DQ9DQ16 and  
DP2. BWc controls DQ17DQ24and DP3. BWd controls  
DQ25DQ32 and DP4. BWa, BWb BWc, and BWd can be  
active only with BWe being LOW. GW being LOW causes all  
bytes to be written. WRITE pass-through capability allows  
written data available at the output for the immediately next  
Read cycle. This device also incorporates pipelined enable  
circuit for easy depth expansion without penalizing system  
performance.  
Functional Description  
The Cypress Synchronous Burst SRAM family employs  
high-speed, low power CMOS designs using advanced single  
layer polysilicon, three-layer metal technology. Each memory  
cell consists of six transistors.  
The CY7C1381BV25 and CY7C1383BV25 SRAMs integrate  
524,288 × 36 and 1,048,576 × 18 SRAM cells with advanced  
synchronous peripheral circuitry and a two-bit counter for  
internal burst operation. All synchronous inputs are gated by  
All inputs and outputs of the CY7C1381BV25 and the  
CY7C1383BV25 are JEDEC standard JESD8-5-compatible.  
Selection Guide  
117 MHz  
7.5  
100 MHz  
8.5  
83 Mhz  
10  
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
Commercial  
210  
190  
160  
30  
mA  
mA  
Maximum CMOS Standby Current  
30  
30  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05249 Rev. *A  
Revised January 18, 2003  

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