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CY7C1383BV25 PDF预览

CY7C1383BV25

更新时间: 2024-09-24 23:45:27
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描述
Memory

CY7C1383BV25 数据手册

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1
CY7C1381BV25  
CY7C1383BV25  
PRELIMINARY  
512K x 36 / 1 Mb x 18 Flow-Thru SRAM  
burst operation. All synchronous inputs are gated by registers  
controlled by a positive-edge-triggered Clock Input (CLK). The  
synchronous inputs include all addresses, all data inputs, ad-  
dress-pipelining Chip Enable (CE), Burst Control Inputs (AD-  
Features  
• Fast access times: 6.5, 7.5, 8.5 ns  
• Fast clock speed: 133, 117, 100 MHz  
• Provide high-performance 3-1-1-1 access rate  
• Optimal for depth expansion  
SC, ADSP, and ADV), Write Enables (BWa, BWb, BWc,  
BWd,and BWe), and Global Write (GW).  
• 2.5V (+5%) power supply  
... Asynchronous inputs include the Output Enable (OE) and  
burst Mode Control (MODE). The Data Outputs (Q), enabled  
by OE, are also asynchronous.  
• Common data inputs and data outputs  
• Byte Write Enable and Global Write control  
• Chip enable for address pipeline  
• Address, data, and control registers  
• Internally self-timed Write Cycle  
• Burst control pins (interleaved or linear burst  
sequence)  
• Automatic power-down for portable applications  
• High-density, high-speed packages  
Addresses and chip enables are registered with either Ad-  
dress Status Processor (ADSP) or Address Status Controller  
(ADSC) input pins. Subsequent burst addresses can be inter-  
nally generated as controlled by the Burst Advance Pin (ADV).  
Address, data inputs, and write controls are registered on-chip  
to initiate self-timed WRITE cycle. WRITE cycles can be one  
to four bytes wide as controlled by the write control inputs.  
Individual byte write allows individual byte to be written. BWa  
controls DQ1–DQ8 and DQP1. BWb controls DQ9–DQ16 and  
DQP2. BWc controls DQ17–DQ24and DQP3. BWd controls  
DQ25–DQ32 and DQP4. BWa, BWb BWc, and BWd can be  
active only with BWe being LOW. GW being LOW causes all  
bytes to be written. WRITE pass-through capability allows writ-  
ten data available at the output for the immediately next READ  
cycle. This device also incorporates pipelined enable circuit for  
easy depth expansion without penalizing system performance.  
• JTAG boundary scan for BGA packaging version  
Functional Description  
The Cypress Synchronous Burst SRAM family employs  
high-speed, low power CMOS designs using advanced single  
layer polysilicon, three-layer metal technology. Each memory  
cell consists of six transistors.  
The CY7C1381BV25 and CY7C1383BV25 SRAMs integrate  
524,288x36 and 1,048,576x18SRAM cells with advanced syn-  
chronous peripheral circuitry and a 2-bit counter for internal  
All inputs and outputs of the CY7C1381BV25 and the  
CY7C1383BV25 are JEDEC standard JESD8-5 compatible.  
Selection Guide  
133 MHz  
6.5  
117 MHz  
7.5  
100 MHz  
8.5  
Maximum Access Time (ns)  
Maximum Operating Current (mA)  
Commercial  
200  
175  
150  
Maximum CMOS Standby Current (mA)  
30  
30  
30  
Shaded areas contain advance information.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
July 2, 2001  

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CY7C1383BV25-100BZI CYPRESS

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暂无描述
CY7C1383BV25-133BGC CYPRESS

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CY7C1383BV25-83BGC CYPRESS

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Standard SRAM, 1MX18, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
CY7C1383BV25-83BZC CYPRESS

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Standard SRAM, 1MX18, 10ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
CY7C1383BV25-83BZI CYPRESS

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