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CY7C1353B-66BGC PDF预览

CY7C1353B-66BGC

更新时间: 2024-11-26 03:57:27
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
15页 536K
描述
256Kx18 Flow-Through SRAM with NoBL Architecture

CY7C1353B-66BGC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA119,7X17,50
针数:119Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.82Base Number Matches:1

CY7C1353B-66BGC 数据手册

 浏览型号CY7C1353B-66BGC的Datasheet PDF文件第2页浏览型号CY7C1353B-66BGC的Datasheet PDF文件第3页浏览型号CY7C1353B-66BGC的Datasheet PDF文件第4页浏览型号CY7C1353B-66BGC的Datasheet PDF文件第5页浏览型号CY7C1353B-66BGC的Datasheet PDF文件第6页浏览型号CY7C1353B-66BGC的Datasheet PDF文件第7页 
353B  
PRELIMINARY  
CY7C1353B  
256Kx18 Flow-Through SRAM with NoBL™ Architecture  
Features  
Functional Description  
• Pin compatible and functionally equivalent to ZBT™  
The CY7C1353B is a 3.3V, 256K by 18 Synchronous  
Flow-Through Burst SRAM designed specifically to support  
unlimited true back-to-back Read/Write operations without the  
insertion of wait states. The CY7C1353B is equipped with the  
advanced No Bus Latency(NoBL) logic required to en-  
able consecutive Read/Write operations with data being trans-  
ferred on every clock cycle. This feature dramatically improves  
the throughput of data through the SRAM, especially in sys-  
tems that require frequent Write-Read transitions. The  
CY7C1353B is pin/functionally compatible to ZBT SRAMs  
MCM63Z819 and MT55L256L18F.  
devices MCM63Z819 and MT55L256L18F  
• Supports 117-MHz bus operations with zero wait states  
— Data is transferred on every clock  
• Internally self-timed output buffer control to eliminate  
the need to use OE  
• Registered inputs for flow-through operation  
• Byte Write capability  
• 256K x 18 common I/O architecture  
• Single 3.3V power supply  
All synchronous inputs pass through input registers controlled  
by the rising edge of the clock. The clock input is qualified by  
the Clock Enable (CEN) signal, which when deasserted sus-  
pends operation and extends the previous clock cycle. Maxi-  
mum access delay from the clock rise is 7.5 ns (117-MHz de-  
vice).  
• Fast clock-to-output times  
7.5 ns (for 117- MHz device)  
8.5 ns (for 100-MHz device)  
11.0 ns (for 66-MHz device)  
12.0 ns (for 50-MHz device)  
Write operations are controlled by the four Byte Write Select  
(BWS[1:0]) and a Write Enable (WE) input. All writes are con-  
ducted with on-chip synchronous self-timed write circuitry.  
14.0 ns (for 40-MHz device)  
Clock Enable (CEN) pin to suspend operation  
Synchronous self-timed writes  
Asynchronous Output Enable  
JEDEC-standard 100 TQFP package  
Burst Capabilitylinear or interleaved burst order  
Low standby power  
Three synchronous Chip Enables (CE1, CE2, CE3) and an  
asynchronous Output Enable (OE) provide for easy bank se-  
lection and output three-state control. In order to avoid bus  
contention, the output drivers are synchronously three-stated  
during the data portion of a write sequence.  
Logic Block Diagram  
18  
D
CLK  
Data-In REG.  
CE  
Q
18  
ADV/LD  
18  
A
[17:0]  
CEN  
CONTROL  
18  
256KX18  
CE  
CE  
1
2
and WRITE  
LOGIC  
MEMORY  
DQ  
DP  
[15:0]  
[1:0]  
CE  
ARRAY  
18  
3
WE  
BWS  
[1:0]  
Mode  
OE  
Selection Guide  
7C1353B-117 7C1353B-100 7C1353B-66 7C1353B-50 7C1353B-40  
Maximum Access Time (ns)  
Maximum Operating Current (mA) Commercial  
7.5  
375  
5
8.5  
350  
5
11.0  
250  
5
12.0  
200  
5
14.0  
175  
5
Maximum CMOS Standby  
Current (mA)  
Commercial  
NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation.  
ZBT is a trademark of Integrated Device Technology.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05266 Rev. **  
Revised March 13, 2002  

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