5秒后页面跳转
CY7C12611KV18 PDF预览

CY7C12611KV18

更新时间: 2024-09-16 12:20:07
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
30页 897K
描述
36-Mbit QDR® II SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)

CY7C12611KV18 数据手册

 浏览型号CY7C12611KV18的Datasheet PDF文件第2页浏览型号CY7C12611KV18的Datasheet PDF文件第3页浏览型号CY7C12611KV18的Datasheet PDF文件第4页浏览型号CY7C12611KV18的Datasheet PDF文件第5页浏览型号CY7C12611KV18的Datasheet PDF文件第6页浏览型号CY7C12611KV18的Datasheet PDF文件第7页 
CY7C12611KV18, CY7C12761KV18  
CY7C12631KV18, CY7C12651KV18  
36-Mbit QDR® II+ SRAM 4-Word Burst  
Architecture (2.5 Cycle Read Latency)  
36-Mbit QDR® II+ SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency)  
Features  
Functional Description  
Separate independent read and write data ports  
Supports concurrent transactions  
The CY7C12611KV18, CY7C12761KV18, CY7C12631KV18,  
and CY7C12651KV18 are 1.8 V Synchronous Pipelined SRAMs,  
equipped with QDR® II+ architecture. Similar to QDR II  
architecture, QDR II+ architecture consists of two separate ports:  
the read port and the write port to access the memory array. The  
read port has dedicated data outputs to support read operations  
550 MHz clock for high bandwidth  
4-word burst for reducing address bus frequency  
Double data rate (DDR) intrfaces on both read and write ports  
and the write port has dedicated data inputs to support write  
operations. QDR II+ architecture has separate data inputs and  
data outputs to completely eliminate the need to “turnaround” the  
data bus that exists with common I/O devices. Each port is  
accessed through a common address bus. Addresses for read  
and write addresses are latched on alternate rising edges of the  
input (K) clock. Accesses to the QDR II+ read and write ports are  
independent of one another. To maximize data throughput, both  
read and write ports are equipped with DDR interfaces. Each  
address location is associated with four 8-bit words  
(CY7C12611KV18), 9-bit words (CY7C12761KV18), 18-bit  
words (CY7C12631KV18), or 36-bit words (CY7C12651KV18)  
that burst sequentially into or out of the device. Because data is  
transferred into and out of the device on every rising edge of both  
input clocks (K and K), memory bandwidth is maximized while  
simplifying system design by eliminating bus “turnarounds”.  
(Data transferred at 1100 MHz) at 550 MHz  
Available in 2.5 clock cycle latency  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
Single multiplexed address input bus latches address inputs  
for read and write ports  
Separate port selects for depth expansion  
Synchronous internally self timed writes  
QDR® II+ operates with 2.5 cycle read latency when DOFF is  
asserted HIGH  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
OperatessimilartoQDRIdevicewith1cyclereadlatencywhen  
DOFF is asserted LOW  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self timed write circuitry.  
Available in x8, x9, x18, and x36 configurations  
Full data coherency, providing most current data  
[1]  
Core VDD = 1.8 V± 0.1 V; I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
These devices are down bonded from the 65 nm 72 M  
QDRII+/DDRII+ devices and hence have the same IDD / ISB1  
values and the same JTAG ID code as the equivalent 72 M  
device options. For details refer to the application note AN53189,  
65 nm Technology Interim QDRII +/ DDRII + SRAM device family  
description.  
High speed transceiver logic (HSTL) inputs and variable drive  
HSTL output buffers  
Available in 165-ball Fine pitch ball grid array (FBGA) package  
(13 x 15 x 1.4 mm)  
Table 1. Selection Guide  
550 500 450 400  
Offered in both Pb-free and non Pb-free packages  
Description  
Unit  
MHz MHz MHz MHz  
Joint test action group (JTAG) 1149.1 compatible test access  
port  
Max operating frequency  
Max operating current  
550 500 450 400 MHz  
x8 900 830 760 690 mA  
x9 900 830 760 690  
Phase locked loop (PLL) for accurate data placement  
Configurations  
x18 920 850 780 710  
x36 1310 1210 1100 1000  
With Read Cycle Latency of 2.5 cycles:  
CY7C12611KV18 – 4 M x 8  
CY7C12761KV18 – 4 M x 9  
CY7C12631KV18 – 2 M x 18  
CY7C12651KV18 – 1 M x 36  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4 V to V  
.
DD  
DDQ  
Cypress Semiconductor Corporation  
Document Number: 001-53193 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 2, 2011  
[+] Feedback  

与CY7C12611KV18相关器件

型号 品牌 获取价格 描述 数据表
CY7C1261KV18 CYPRESS

获取价格

36-Mbit QDR? II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)
CY7C1261V18 CYPRESS

获取价格

36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1261V18-300BZC CYPRESS

获取价格

36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1261V18-300BZI CYPRESS

获取价格

36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1261V18-300BZXC CYPRESS

获取价格

36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1261V18-300BZXI CYPRESS

获取价格

36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1261V18-333BZC CYPRESS

获取价格

36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1261V18-333BZI CYPRESS

获取价格

36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1261V18-333BZXC CYPRESS

获取价格

36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1261V18-333BZXI CYPRESS

获取价格

36-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu