CY7C1261V18
CY7C1276V18
CY7C1263V18
CY7C1265V18
36-Mbit QDR™-II+ SRAM 4-Word
Burst Architecture (2.5 Cycle Read Latency)
Functional Description
Features
• Separate independent read and write data ports
— Supports concurrent transactions
The CY7C1261V18, CY7C1276V18, CY7C1263V18, and
CY7C1265V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with Quad Data Rate-II+ (QDR-II+) architecture.
QDR-II+ architecture consists of two separate ports to access
the memory array. The read port has dedicated data outputs
to support read operations and the write port has dedicated
data inputs to support write operations. QDR-II+ architecture
has separate data inputs and data outputs to completely
eliminate the need to “turn around” the data bus required with
common IO devices. Each port is accessed through a common
address bus. Addresses for read and write addresses are
latched on alternate rising edges of the input (K) clock.
Accesses to the QDR-II+ read and write ports are completely
independent of one another. To maximize data throughput,
both read and write ports are equipped with Double Data Rate
(DDR) interfaces. Each address location is associated with
• 300 MHz to 400 MHz clock for high bandwidth
• 4-Word Burst for reducing address bus frequency
• Double Data Rate (DDR) interfaces on both read and write
ports (data transferred at 800 MHz) at 400 MHz
• Read latency of 2.5 clock cycles
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Echo clocks (CQ and CQ) simplify data capture in
high-speed systems
• Singlemultiplexedaddressinputbuslatchesaddressinputs
for both read and write ports
four
8-bit
words
(CY7C1261V18),
9-bit
words
• Separate Port Selects for depth expansion
• Data valid pin (QVLD) to indicate valid data on the output
• Synchronous internally self-timed writes
(CY7C1276V18), 18-bit words (CY7C1263V18), or 36-bit
words (CY7C1265V18) that burst sequentially into or out of the
device. Because data can be transferred into and out of the
device on every rising edge of both input clocks (K and K),
memory bandwidth is maximized while simplifying system
design by eliminating bus “turn-arounds”.
• Available in x8, x9, x18, and x36 configurations
• Full data coherency providing most current data
[1]
• Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD
Depth expansion is accomplished with Port Selects for each
port. Port selects enable each port to operate independently.
• HSTL inputs and Variable drive HSTL output buffers
• Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
• Offered in both Pb-free and non Pb-free packages
• JTAG 1149.1 compatible test access port
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
• Delay Lock Loop (DLL) for accurate data placement
Configurations
With Read Cycle Latency of 2.0 cycles:
CY7C1261V18 – 4M x 8
CY7C1276V18 – 4M x 9
CY7C1263V18 – 2M x 18
CY7C1265V18 – 1M x 36
Selection Guide
400 MHz
400
375 MHz
333 MHz
333
300 MHz
300
Unit
MHz
mA
Maximum Operating Frequency
Maximum Operating Current
375
1330
1240
1120
1040
Note
1. The QDR consortium specification for V
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting
DDQ
V
= 1.4V to V
.
DDQ
DD
Cypress Semiconductor Corporation
Document Number: 001-06366 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised May 14, 2007
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