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CY7C1262XV18-450BZXC PDF预览

CY7C1262XV18-450BZXC

更新时间: 2024-09-15 21:01:19
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
29页 1012K
描述
QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165

CY7C1262XV18-450BZXC 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:BGA包装说明:LBGA, BGA165,11X15,40
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
Factory Lead Time:1 week风险等级:2.31
最长访问时间:0.45 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):450 MHzI/O 类型:SEPARATE
JESD-30 代码:R-PBGA-B165JESD-609代码:e1
长度:15 mm内存密度:37748736 bit
内存集成电路类型:QDR SRAM内存宽度:18
湿度敏感等级:3功能数量:1
端子数量:165字数:2097152 words
字数代码:2000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:2MX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:1.5,1.8 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:1.205 A最小待机电流:1.7 V
子类别:SRAMs最大压摆率:1.205 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:13 mm
Base Number Matches:1

CY7C1262XV18-450BZXC 数据手册

 浏览型号CY7C1262XV18-450BZXC的Datasheet PDF文件第2页浏览型号CY7C1262XV18-450BZXC的Datasheet PDF文件第3页浏览型号CY7C1262XV18-450BZXC的Datasheet PDF文件第4页浏览型号CY7C1262XV18-450BZXC的Datasheet PDF文件第5页浏览型号CY7C1262XV18-450BZXC的Datasheet PDF文件第6页浏览型号CY7C1262XV18-450BZXC的Datasheet PDF文件第7页 
CY7C1262XV18  
CY7C1264XV18  
36-Mbit QDR® II+ Xtreme SRAM Two-Word  
Burst Architecture (2.5 Cycle Read Latency)  
36-Mbit QDR® II+ Xtreme SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency)  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
With Read Cycle Latency of 2.5 cycles:  
CY7C1262XV18 – 2 M × 18  
450 MHz clock for high bandwidth  
CY7C1264XV18 – 1 M × 36  
Two-word burst for reducing address bus frequency  
Functional Description  
DoubleDataRate(DDR)interfacesonbothreadandwriteports  
(data transferred at 900 MHz) at 450 MHz  
The CY7C1262XV18, and CY7C1264XV18 are 1.8 V  
Synchronous Pipelined SRAMs, equipped with QDR® II+  
architecture. Similar to QDR II architecture, QDR II+ architecture  
consists of two separate ports: the read port and the write port to  
access the memory array. The read port has dedicated data  
outputs to support read operations and the write port has  
dedicated data inputs to support write operations. QDR II+  
architecture has separate data inputs and data outputs to  
completely eliminate the need to “turnaround” the data bus that  
exists with common I/O devices. Access to each port is through  
a common address bus. Addresses for read and write addresses  
are latched on alternate rising edges of the input (K) clock.  
Accesses to the QDR II+ Xtreme read and write ports are  
completely independent of one another. To maximize data  
throughput, both read and write ports are equipped with DDR  
interfaces. Each address location is associated with two 18-bit  
words (CY7C1262XV18), or 36-bit words (CY7C1264XV18) that  
burst sequentially into or out of the device. Because data can be  
transferred into and out of the device on every rising edge of both  
input clocks (K and K), memory bandwidth is maximized while  
simplifying system design by eliminating bus “turnarounds”.  
Available in 2.5 clock cycle latency  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
Single multiplexed address input bus latches address inputs  
for both read and write ports  
Separate port selects for depth expansion  
Synchronous internally self-timed writes  
QDR™-II+ Xtreme operates with 2.5 cycle read latency when  
DOFF is asserted HIGH  
Operates similar to QDR-I device with 1 cycle read latency  
when DOFF is asserted LOW  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
Available in x18, and x36 configurations  
Full data coherency, providing most current data  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Core VDD = 1.8 V ± 0.1 V; I/Os VDDQ = 1.4 V to 1.6 V  
Supports 1.5 V I/O supply  
HSTL inputs and variable drive HSTL output buffers  
Available in 165-ball FBGA package (13 × 15 × 1.4 mm)  
Offered in Pb-free packages  
For a complete list of related documentation, click here.  
JTAG 1149.1 compatible test access port  
Phase-Locked Loop (PLL) for accurate data placement  
Selection Guide  
Description  
Maximum Operating Frequency  
450 MHz  
450  
366 MHz Unit  
366  
970  
MHz  
mA  
Maximum Operating Current  
× 18  
× 36  
1205  
1445  
1165  
Cypress Semiconductor Corporation  
Document Number: 001-70327 Rev. *G  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised December 22, 2017  
 

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