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CY7C1020-10ZC PDF预览

CY7C1020-10ZC

更新时间: 2024-01-14 13:19:08
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
9页 178K
描述
32K x 16 Static RAM

CY7C1020-10ZC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2-44
针数:44Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:8.64最长访问时间:10 ns
其他特性:AUTOMATIC POWER-DOWNI/O 类型:COMMON
JESD-30 代码:R-PDSO-G44JESD-609代码:e0
长度:18.41 mm内存密度:524288 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
湿度敏感等级:3功能数量:1
端口数量:1端子数量:44
字数:32768 words字数代码:32000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32KX16
输出特性:3-STATE可输出:YES
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP44,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):240电源:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.001 A最小待机电流:4.5 V
子类别:SRAMs最大压摆率:0.18 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:10.16 mm

CY7C1020-10ZC 数据手册

 浏览型号CY7C1020-10ZC的Datasheet PDF文件第1页浏览型号CY7C1020-10ZC的Datasheet PDF文件第2页浏览型号CY7C1020-10ZC的Datasheet PDF文件第3页浏览型号CY7C1020-10ZC的Datasheet PDF文件第5页浏览型号CY7C1020-10ZC的Datasheet PDF文件第6页浏览型号CY7C1020-10ZC的Datasheet PDF文件第7页 
CY7C1020  
Switching Characteristics[4] Over the Operating Range  
7C1020-10  
7C1020-12  
7C1020-15  
7C1020-20  
Parameter  
Description  
Min. Max. Min. Max. Min. Max. Min. Max. Unit  
READ CYCLE  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Read Cycle Time  
10  
3
12  
3
15  
3
20  
3
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low Z  
10  
12  
15  
20  
AA  
OHA  
ACE  
DOE  
LZOE  
HZOE  
LZCE  
HZCE  
PU  
10  
5
12  
5
15  
7
20  
9
0
3
0
0
3
0
0
3
0
0
3
0
[5, 6]  
OE HIGH to High Z  
5
5
6
6
7
7
8
8
[6]  
CE LOW to Low Z  
[5, 6]  
CE HIGH to High Z  
CE LOW to Power-Up  
CE HIGH to Power-Down  
Byte enable to Data Valid  
Byte enable to Low Z  
12  
5
12  
6
15  
7
20  
9
PD  
DBE  
LZBE  
HZBE  
0
0
0
0
Byte disable to High Z  
5
6
7
9
[7]  
WRITE CYCLE  
t
t
t
t
t
t
t
t
t
t
t
Write Cycle Time  
10  
8
12  
9
15  
10  
10  
0
12  
12  
12  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
WC  
SCE  
AW  
CE LOW to Write End  
Address Set-Up to Write End  
Address Hold from Write End  
Address Set-Up to Write Start  
WE Pulse Width  
7
8
0
0
HA  
0
0
0
0
SA  
7
8
10  
10  
0
12  
10  
0
PWE  
SD  
Data Set-Up to Write End  
Data Hold from Write End  
5
6
0
0
HD  
[6]  
WE HIGH to Low Z  
3
3
3
3
LZWE  
HZWE  
BW  
[5, 6]  
WE LOW to High Z  
5
6
7
9
Byte enable to end of write  
7
8
9
12  
Notes:  
4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified  
I
t
OL/IOH and 30-pF load capacitance.  
5.  
HZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.  
6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.  
7. The internal write time of the memory is defined by the overlap of CELOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a write,  
and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.  
4

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