Datasheet > CY62148EV30_12

CY62148EV30_12

更新时间： 2022-03-31 02:22:25

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		/
页数	文件大小	规格书
18页	414K
描述
4-Mbit (512 K Ã 8) Static RAM

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CY62148EV30_12 数据手册

CY62148EV30 MoBL^®

4-Mbit (512 K × 8) Static RAM

4-Mbit (512

K × 8) Static RAM

Features

Functional Description

■ Very high speed: 45 ns

❐ Wide voltage range: 2.20 V to 3.60 V

The CY62148EV30 is a high performance CMOS static RAM

organized as 512 K words by 8 bits. This device features

advanced circuit design to provide ultra low active current. This

is ideal for providing More Battery Life™ (MoBL^) in portable

applications such as cellular telephones. The device also has an

automatic power down feature that significantly reduces power

consumption. Placing the device into standby mode reduces

power consumption by more than 99 percent when deselected

(CE HIGH). The eight input and output pins (I/O₀through I/O₇)

are placed in a high impedance state when the device is

deselected (CE HIGH), the outputs are disabled (OE HIGH), or

during a write operation (CE LOW and WE LOW).

■ Temperature range:

❐ Industrial: –40 °C to +85 °C

❐ Automotive-A: –40 °C to +85 °C

■ Pin compatible with CY62148DV30

■ Ultra low standby power

❐ Typical standby current: 1 A

❐ Maximum standby current: 7 A (Industrial)

■ Ultra low active power

❐ Typical active current: 2 mA at f = 1 MHz

To write to the device, take Chip Enable (CE) and Write Enable

(WE) inputs LOW. Data on the eight I/O pins (I/O₀through I/O₇)

is then written into the location specified on the address pins (A₀

through A₁₈).

■ Easy memory expansion with CE and OE features

■ Automatic power down when deselected

To read from the device, take Chip Enable (CE) and Output

Enable (OE) LOW while forcing Write Enable (WE) HIGH. Under

these conditions, the contents of the memory location specified

by the address pins appear on the I/O pins.

■ Complementary metal oxide semiconductor (CMOS) for

optimum speed and power

■ Available in Pb-free 36-ball very fine-pitch ball grid array

(VFBGA), 32-pin thin small outline package (TSOP) II, and

32-pin small outline integrated circuit (SOIC) ^[1]packages

Logic Block Diagram

I/O

INPUT BUFFER

I/O

512K x 8

ARRAY

I/O

POWER

DOWN

COLUMN DECODER

Note

1. SOIC package is available only in 55 ns speed bin.

Cypress Semiconductor Corporation

Document Number: 38-05576 Rev. *O

•

198 Champion Court

•

San Jose, CA 95134-1709

•

408-943-2600

Revised September 4, 2012

12 3 4 5 6 7...18

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