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CP353V PDF预览

CP353V

更新时间: 2024-11-06 03:26:23
品牌 Logo 应用领域
CENTRAL 晶体晶体管
页数 文件大小 规格书
1页 71K
描述
Small Signal Transistors NPN - High Current Transistor Chip

CP353V 数据手册

  
PROCESS CP353V  
Small Signal Transistors  
NPN - High Current Transistor Chip  
PROCESS DETAILS  
Process  
EPITAXIAL PLANAR  
66 x 66 MILS  
7.1 MILS  
Die Size  
Die Thickness  
Base Bonding Pad Area  
Emitter 1 Bonding Pad Area  
Emitter 2 Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
7.9 x 7.9 MILS  
7.9 x 9.5 MILS  
7.9 x 9.5 MILS  
Al-Si 30,000Å  
Au  
12,000Å  
GEOMETRY  
GROSS DIER PER 5 INCH WAFER  
3,878  
PRINCIPAL DEVICE TYPES  
CZT853  
145 Adams Avenue  
Hauppauge, NY 11788 USA  
Tel: (631) 435-1110  
Fax: (631) 435-1824  
www.centralsemi.com  
R0 (23- September 2005)  

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