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CP307 PDF预览

CP307

更新时间: 2024-10-28 03:26:23
品牌 Logo 应用领域
CENTRAL 晶体晶体管达林顿晶体管
页数 文件大小 规格书
2页 212K
描述
Small Signal Transistor NPN - Silicon Darlington Transistor Chip

CP307 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:compliant风险等级:5.58
Base Number Matches:1

CP307 数据手册

 浏览型号CP307的Datasheet PDF文件第2页 
TM  
PROCESS CP307  
Central  
Small Signal Transistor  
NPN - Silicon Darlington Transistor Chip  
Semiconductor Corp.  
PROCESS DETAILS  
Process  
EPITAXIAL PLANAR  
Die Size  
Die Thickness  
27 x 27 MILS  
9.0 MILS  
Base Bonding Pad Area  
Emitter Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
5.3 x 3.8 MILS  
5.3 x 6.5 MILS  
Al - 30,000Å  
Au - 18,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
15,440  
PRINCIPAL DEVICE TYPES  
2N6426  
2N6427  
CMPT6427  
CMPTA13  
CMPTA14  
CXTA14  
CZTA14  
MPSA13  
MPSA14  
BACKSIDE COLLECTOR  
145 Adams Avenue  
Hauppauge, NY 11788 USA  
Tel: (631) 435-1110  
Fax: (631) 435-1824  
R3 (1-August 2002)  
www.centralsemi.com  

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