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CP307-MPSA27 PDF预览

CP307-MPSA27

更新时间: 2024-10-29 14:54:23
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
5页 692K
描述
500mA,60V Bare die,27.170 X 27.170 mils,Transistor-Small Signal (<=1A)

CP307-MPSA27 数据手册

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PROCESS CP307  
Small Signal Transistor  
NPN - Silicon Darlington Transistor Chip  
PROCESS DETAILS  
Process  
EPITAXIAL PLANAR  
Die Size  
27 x 27 MILS  
9.0 MILS  
Die Thickness  
Base Bonding Pad Area  
Emitter Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
5.3 x 3.8 MILS  
5.3 x 6.5 MILS  
Al - 30,000Å  
Au - 18,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
15,165  
PRINCIPAL DEVICE TYPES  
2N6426  
2N6427  
CMPT6427  
CMPTA13  
CMPTA14  
CXTA14  
CZTA14  
MPSA13  
MPSA14  
MPSA27  
BACKSIDE COLLECTOR  
R6 (22-March 2010)  
www.centralsemi.com  

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