TH97/10561QM
TW00/17276EM
IATF 0060636
SGS TH07/1033
ULTRA FAST LOW-LOSS RECTIFIER
BYD127A
SMA (DO-214AC)
PRV : 200 Volts
Io : 2.0 Amperes
1.1 ± 0.3
FEATURES :
0.2 ± 0.07
* Glass passivated junction chip
* High maximum operating temperature
* Low leakage current
1.2 ± 0.2
2.1 ± 0.2
2.6 ± 0.15
* Excellent stability
* Smallest surface mount rectifier outline
* Pb / RoHS Free
2.0 ± 0.2
MECHANICAL DATA :
* Case : SMA Molded plastic
Dimensions in millimeters
* Epoxy : UL94V-O rate flame retardant
* Lead : Lead Formed for Surface Mount
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.067 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25 °C ambient temperature unless otherwise specified
RATING
VALUE
SYMBOL
UNIT
VRRM
VR
200
Maximum Repetitive Peak Reverse Voltage
V
V
200
Maximum Continuous Reverse Voltage
IF(AV)
IFSM
VF
2.0
Maximum Average Forward Current (Note 1)
Maximum Non-Repetitive Peak Forward Surge Current (Note 2)
Maximum Forward Voltage at IF = 1.0 A, TJ = 25 °C
A
15
A
0.93
V
Maximum Reverse Current at VR = VRRMmax
TJ = 25 °C
IR
2.0
μA
μA
ns
TJ = 150 °C
IR(H)
Trr
50
25
Maximum Reverse Recovery Time (Note 3)
Thermal Resistance from Junction to Tie-Point
30
Rth j-tp
Rth j-a
TJ
K / W
K / W
°C
150
Thermal Resistance from Junction to Ambient (Note 4)
Junction Temperature Range
- 65 to + 175
- 65 to + 175
TSTG
Storage Temperature Range
°C
Notes :
(1) Ttp = 95 °C; averaged over any 20 ms period; see Fig. 1 and 2.
(2) t=10ms half sine wave; Tj = Tjmax prior to surge; VR = VRRMmax.
(3) Reverse Recovery Test Conditions : IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.
(4) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥ 40 μm.
Page 1 of 2
Rev. 00 : February 13, 2008