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BLM6G10-30 PDF预览

BLM6G10-30

更新时间: 2024-11-16 06:42:43
品牌 Logo 应用领域
恩智浦 - NXP 电信集成电路蜂窝电话电路电信电路光电二极管
页数 文件大小 规格书
11页 81K
描述
W-CDMA 900 MHz - 1000 MHz power MMIC

BLM6G10-30 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:PLASTIC, SOT834-1, HSOP-16针数:16
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84Is Samacsys:N
JESD-30 代码:R-PDSO-F16JESD-609代码:e3
长度:15.9 mm功能数量:1
端子数量:16封装主体材料:PLASTIC/EPOXY
封装代码:HSOF封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG峰值回流温度(摄氏度):260
认证状态:Not Qualified标称供电电压:28 V
表面贴装:YES电信集成电路类型:BASEBAND CIRCUIT
端子面层:TIN端子形式:FLAT
端子节距:1.37 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:11 mm
Base Number Matches:1

BLM6G10-30 数据手册

 浏览型号BLM6G10-30的Datasheet PDF文件第2页浏览型号BLM6G10-30的Datasheet PDF文件第3页浏览型号BLM6G10-30的Datasheet PDF文件第4页浏览型号BLM6G10-30的Datasheet PDF文件第5页浏览型号BLM6G10-30的Datasheet PDF文件第6页浏览型号BLM6G10-30的Datasheet PDF文件第7页 
BLM6G10-30; BLM6G10-30G  
W-CDMA 900 MHz - 1000 MHz power MMIC  
Rev. 01 — 28 August 2009  
Objective data sheet  
1. Product profile  
1.1 General description  
30 W LDMOS 2-stage power MMIC for base station applications at frequencies from  
920 MHz to 960 MHz. Available in Gull Wing for surface mount (SOT822-1) or flat lead  
(SOT834-1)  
Table 1.  
Typical performance  
Typical RF performance at Th = 25 °C.  
Mode of operation  
f
VDS  
(V)  
28  
PL(AV)  
(W)  
2
Gp  
ηD  
IMD3  
(dBc)  
ACPR  
(dBc)  
(MHz)  
(dB)  
29  
(%)  
2-carrier W-CDMA  
f1 = 935; f2 = 945  
11.5 48.5[1] 52[1]  
[1] Test signal: 3GPP; test model 1; 64 DPCH; PAR = 7 dB at 0.01 % probability on CCDF per carrier;  
carrier spacing 10 MHz.  
CAUTION  
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken  
during transport and handling.  
1.2 Features  
I Typical 2-carrier W-CDMA performance at a frequency of 940 MHz:  
N Average output power = 2 W  
N Gain = 29 dB (typ)  
N Efficiency = 11.5 %  
N IMD3 = 48.5 dBc  
N ACPR = 52 dBc  
I Integrated temperature compensated bias  
I Excellent thermal stability  
I Biasing of individual stages is externally accessible  
I Integrated ESD protection  
I Small component size, very suitable for PA size reduction  
I On-chip matching (input matched to 50 ohm, output partially matched)  
I High power gain  
I Designed for broadband operation (920 MHz to 960 MHz)  

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