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BGA425 PDF预览

BGA425

更新时间: 2024-11-23 22:27:39
品牌 Logo 应用领域
英飞凌 - INFINEON 放大器射频微波
页数 文件大小 规格书
8页 84K
描述
Si-MMIC-Amplifier in SIEGET 25-Technologie (Multifunctional casc. 50 ヘ block LNA / MIX Unconditionally stable)

BGA425 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SOT-363, 6 PINReach Compliance Code:unknown
风险等级:5.12特性阻抗:50 Ω
构造:COMPONENT增益:18.5 dB
最大输入功率 (CW):-10 dBmJESD-609代码:e0
安装特点:SURFACE MOUNT端子数量:6
最大工作频率:1800 MHz最小工作频率:100 MHz
最高工作温度:150 °C最低工作温度:-65 °C
封装主体材料:PLASTIC/EPOXY封装等效代码:TSSOP6,.08
电源:3 V射频/微波设备类型:WIDE BAND LOW POWER
子类别:RF/Microwave Amplifiers最大压摆率:9.5 mA
表面贴装:YES技术:BIPOLAR
端子面层:Tin/Lead (Sn/Pb)Base Number Matches:1

BGA425 数据手册

 浏览型号BGA425的Datasheet PDF文件第2页浏览型号BGA425的Datasheet PDF文件第3页浏览型号BGA425的Datasheet PDF文件第4页浏览型号BGA425的Datasheet PDF文件第5页浏览型号BGA425的Datasheet PDF文件第6页浏览型号BGA425的Datasheet PDF文件第7页 
BGA 425  
Si-MMIC-Amplifier  
Preliminary data  
in SIEGET 25-Technologie  
3
Multifunctional casc. 50 block (LNA / MIX)  
4
Unconditionally stable  
2
Gain |S | = 18.5 dB at 1.8 GHz (appl.1)  
21  
2
gain |S | = 22 dB at 1.8 GHz (appl.2)  
21  
2
IP  
= +7 dBm at 1.8 GHz (V =3V,I =9.5mA)  
D D  
3out  
VPS05605  
1
Noise figure NF = 2.2 dB at 1.8 GHz  
Reverse isolation >28 dB (appl.1) >35 dB (appl.2)  
Circuit Diagram  
typical device voltage V = 2 V to 5 V  
D
6
+V  
Tape loading orientation  
3
OUTA  
1
OUTB  
4
IN  
2, 5  
GND  
EHA07371  
ESD: Electrostatic discharge sensitive device,  
observe handling precaution!  
PIN Configuration  
2, GND  
Q62702-G0058 SOT-343 4, IN 5, GND  
Type  
Marking Ordering Code Package 1, Out B  
3, Out A  
6, +V  
BGA 425 BMs  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
mA  
V
Device current  
Device voltage  
25  
6
I
D
V ,+V  
D
150  
mW  
dBm  
°C  
Total power dissipation, T tbd °C  
P
P
T
T
T
tot  
RFin  
j
S
-10  
R input power  
F
Junction temperature  
Ambient temperature  
Storage temperature  
150  
-65 ...+150  
-65 ...+150  
A
stg  
Thermal Resistance  
1)  
Junction - soldering point  
K/W  
R
tbd  
thJS  
1) T is measured on the ground lead at the soldering point to the pcb  
S
Semiconductor Group  
1
Jul-14-1998  
1998-11-01  
Semiconductor Group  
1

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