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BGA5M1BN6E6327XTSA1 PDF预览

BGA5M1BN6E6327XTSA1

更新时间: 2024-10-28 20:58:59
品牌 Logo 应用领域
英飞凌 - INFINEON 电信电信集成电路
页数 文件大小 规格书
12页 318K
描述
Telecom Circuit,

BGA5M1BN6E6327XTSA1 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:TSNP-6Reach Compliance Code:compliant
风险等级:1.62JESD-30 代码:R-XBCC-B6
长度:1.1 mm湿度敏感等级:1
功能数量:1端子数量:6
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:BCC
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:0.4 mm
标称供电电压:1.8 V表面贴装:YES
电信集成电路类型:TELECOM CIRCUIT温度等级:INDUSTRIAL
端子形式:BUTT端子节距:0.4 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:0.7 mmBase Number Matches:1

BGA5M1BN6E6327XTSA1 数据手册

 浏览型号BGA5M1BN6E6327XTSA1的Datasheet PDF文件第2页浏览型号BGA5M1BN6E6327XTSA1的Datasheet PDF文件第3页浏览型号BGA5M1BN6E6327XTSA1的Datasheet PDF文件第4页浏览型号BGA5M1BN6E6327XTSA1的Datasheet PDF文件第5页浏览型号BGA5M1BN6E6327XTSA1的Datasheet PDF文件第6页浏览型号BGA5M1BN6E6327XTSA1的Datasheet PDF文件第7页 
BGA5M1BN6  
BGA5M1BN6  
18dB High Gain Low Noise Amplifier for LTE Midband  
Features  
Operating frequencies: 1805 - 2200 MHz  
Insertion power gain: 19.3 dB  
Insertion Loss in bypass mode: 4.7 dB  
Low noise figure: 0.65 dB  
Low current consumption: 9.5 mA  
Multi-state control: Bypass- and high gain-Mode  
Ultra small TSNP-6-10 leadless package  
RF output internally matched to 50 Ohm  
Low external component count  
0.7 x 1.1 mm2  
Application  
The LTE data rate can be significantly improved by using the Low Noise Amplifier. The integrated bypass function  
increases the overall system dynamic range and leads to more flexibility in the RF front-end.  
In high gain mode the LNA offers best Noise Figure to ensure high data rates even on the LTE cell edge. Closer to  
the basestation the bypass mode can be activated reducing current consumption.  
Product Validation  
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22  
Block diagram  
VCC  
C
AI  
AO  
ESD  
GND  
BGA5M1BN6_Blockdiagram.vsd  
Data Sheet  
www.infineon.com  
Revision 2.2  
2018-03-15  

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