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BGA427H6327XTSA1 PDF预览

BGA427H6327XTSA1

更新时间: 2024-11-27 12:53:51
品牌 Logo 应用领域
英飞凌 - INFINEON 放大器
页数 文件大小 规格书
7页 548K
描述
Si-MMIC-Amplifier in SIEGET 25-Technologie

BGA427H6327XTSA1 技术参数

是否Rohs认证: 符合生命周期:Not Recommended
Reach Compliance Code:compliantFactory Lead Time:6 weeks
风险等级:7.78特性阻抗:50 Ω
构造:COMPONENT增益:18.5 dB
最大输入功率 (CW):-10 dBmJESD-609代码:e3
最大工作频率:1800 MHz最小工作频率:100 MHz
最高工作温度:150 °C最低工作温度:-65 °C
射频/微波设备类型:NARROW BAND MEDIUM POWER端子面层:Tin (Sn)
Base Number Matches:1

BGA427H6327XTSA1 数据手册

 浏览型号BGA427H6327XTSA1的Datasheet PDF文件第2页浏览型号BGA427H6327XTSA1的Datasheet PDF文件第3页浏览型号BGA427H6327XTSA1的Datasheet PDF文件第4页浏览型号BGA427H6327XTSA1的Datasheet PDF文件第5页浏览型号BGA427H6327XTSA1的Datasheet PDF文件第6页浏览型号BGA427H6327XTSA1的Datasheet PDF文件第7页 
BGA427  
in SIEGET 25-Technologie  
Si-MMIC-Amplifier  
Cascadable 50 -gain block  
Unconditionally stable  
3
2
1
4
2
Gain |S | = 18.5 dB at 1.8 GHz (Appl.1)  
21  
2
gain |S | = 22 dB at 1.8 GHz (Appl.2)  
21  
IP  
= +7 dBm at 1.8 GHz (V =3V, I =9.4mA)  
3out  
D D  
Noise figure NF = 2.2 dB at 1.8 GHz  
3
+V  
Typical device voltage V = 2 V to 5 V  
D
Reverse isolation > 35 dB (Appl.2)  
Pb-free (RoHS compliant) package  
4
OUT  
Circuit Diagram  
1
IN  
2
EHA07378  
GND  
ESD (Electrostatic discharge) sensitive device, observe handling precaution!  
Type  
BGA427  
Marking  
BMs  
Pin Configuration  
2, GND 3, +V  
Package  
SOT343  
1, IN  
4, Out  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
25  
mA  
Device current  
I
D
Device voltage  
V ,+V  
6
V
D
150  
mW  
Total power dissipation  
P
tot  
T = 120 °C  
S
dBm  
°C  
RF input power  
Junction temperature  
P
T
j
-10  
150  
RFin  
Ambient temperature range  
Storage temperature range  
T
T
-65 ... 150  
-65 ... 150  
A
stg  
Thermal Resistance  
Junction - soldering point  
1)  
K/W  
R
295  
thJS  
1
For calculation of R  
please refer to Application Note Thermal Resistance  
thJA  
2011-09-15  
1

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