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APTM10DUM05TG PDF预览

APTM10DUM05TG

更新时间: 2024-11-24 03:30:51
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
6页 287K
描述
Dual common source MOSFET Power Module

APTM10DUM05TG 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:ROHS COMPLIANT, SP4, 4 PIN针数:12
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.84Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):3000 mJ
外壳连接:ISOLATED配置:COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):278 A
最大漏极电流 (ID):278 A最大漏源导通电阻:0.005 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PUFM-X4
JESD-609代码:e3元件数量:2
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):780 W最大脉冲漏极电流 (IDM):1100 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:MATTE TIN
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

APTM10DUM05TG 数据手册

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APTM10DUM05TG  
VDSS = 100V  
Dual common source  
RDSon = 4.5mtyp @ Tj = 25°C  
MOSFET Power Module  
ID = 278A @ Tc = 25°C  
Application  
AC Switches  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
D1  
D2  
Q1  
Q2  
Features  
G1  
G2  
Power MOS V® MOSFETs  
-
-
-
-
-
Low RDSon  
S1  
S2  
Low input and Miller capacitance  
Low gate charge  
S
NTC1  
Avalanche energy rated  
Very rugged  
NTC2  
Kelvin source for easy drive  
Very low stray inductance  
-
-
Symmetrical design  
Lead frames for power connections  
Internal thermistor for temperature monitoring  
High level of integration  
G2  
S2  
OUT  
OUT  
Benefits  
Outstanding performance at high frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for  
easy PCB mounting  
VBUS  
0/VBUS  
S1  
G1  
S2  
G2  
NTC2  
NTC1  
Low profile  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VDSS  
Drain - Source Breakdown Voltage  
100  
278  
207  
1100  
±30  
5
V
Tc = 25°C  
ID  
Continuous Drain Current  
A
Tc = 80°C  
IDM  
VGS  
RDSon  
Pulsed Drain current  
Gate - Source Voltage  
Drain - Source ON Resistance  
V
m  
W
PD  
IAR  
EAR  
EAS  
Maximum Power Dissipation  
Tc = 25°C  
780  
100  
50  
Avalanche current (repetitive and non repetitive)  
A
Repetitive Avalanche Energy  
mJ  
Single Pulse Avalanche Energy  
3000  
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
www.microsemi.com  
1 - 6  

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