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2SC5714(TE12L,F) PDF预览

2SC5714(TE12L,F)

更新时间: 2024-11-09 14:39:23
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 136K
描述
TRANSISTOR,BJT,NPN,20V V(BR)CEO,4A I(C),SC-62

2SC5714(TE12L,F) 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:,Reach Compliance Code:unknown
风险等级:5.61Is Samacsys:N
最大集电极电流 (IC):4 A配置:Single
最小直流电流增益 (hFE):400最高工作温度:150 °C
极性/信道类型:NPN最大功率耗散 (Abs):2.5 W
子类别:Other Transistors表面贴装:YES
Base Number Matches:1

2SC5714(TE12L,F) 数据手册

 浏览型号2SC5714(TE12L,F)的Datasheet PDF文件第2页浏览型号2SC5714(TE12L,F)的Datasheet PDF文件第3页浏览型号2SC5714(TE12L,F)的Datasheet PDF文件第4页浏览型号2SC5714(TE12L,F)的Datasheet PDF文件第5页 
2SC5714  
TOSHIBA Transistor Silicon NPN Epitaxial Type  
2SC5714  
High-Speed Switching Applications  
Unit: mm  
DC-DC Converter Applications  
Strobe Applications  
High DC current gain: h = 400 to 1000 (I = 0.5 A)  
FE  
C
Low collector-emitter saturation voltage: V  
= 0.15 V (max)  
CE (sat)  
High-speed switching: t = 90 ns (typ.)  
f
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
40  
V
V
V
V
CBO  
Collector-emitter voltage  
Collector-emitter voltage  
Emitter-base voltage  
V
30  
CEX  
CEO  
EBO  
V
V
20  
7
DC  
I
4
7
C
Collector current  
Base current  
A
mA  
W
JEDEC  
JEITA  
Pulse  
I
CP  
SC-62  
2-5K1A  
I
400  
B
DC  
P
1.0  
TOSHIBA  
C
Collector power  
dissipation  
(Note 1)  
t = 10 s  
2.5  
Weight: 0.05 g (typ.)  
Junction temperature  
T
150  
°C  
°C  
j
Storage temperature range  
T
stg  
55 to 150  
Note 1: Mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2)  
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2010-03-10  

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