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1N6642U PDF预览

1N6642U

更新时间: 2024-09-08 23:16:11
品牌 Logo 应用领域
美高森美 - MICROSEMI 二极管开关
页数 文件大小 规格书
2页 46K
描述
SWITCHING DIODES

1N6642U 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Transferred包装说明:HERMETIC SEALED, GLASS, D-5D, 2 PIN
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.70
风险等级:8.04其他特性:METALLURGICALLY BONDED
外壳连接:ISOLATED配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):1.2 VJESD-30 代码:O-LELF-R2
JESD-609代码:e0最大非重复峰值正向电流:2.5 A
元件数量:1端子数量:2
最高工作温度:200 °C最低工作温度:-65 °C
最大输出电流:0.3 A封装主体材料:GLASS
封装形状:ROUND封装形式:LONG FORM
峰值回流温度(摄氏度):NOT SPECIFIED最大功率耗散:0.75 W
认证状态:Not Qualified最大重复峰值反向电压:75 V
最大反向电流:0.5 µA最大反向恢复时间:0.005 µs
表面贴装:YES端子面层:TIN LEAD
端子形式:WRAP AROUND端子位置:END
处于峰值回流温度下的最长时间:NOT SPECIFIED

1N6642U 数据手册

 浏览型号1N6642U的Datasheet PDF文件第2页 
• 1N6638US,1N6642US, 1N6643US AVAILABLE IN JAN, JANTX, JANTXV AND JANS  
PER MIL-PRF-19500/578  
• 1N6638U,1N6642U, 1N6643U AVAILABLE IN JAN, JANTX, JANTXV AND JANS  
1N6638U & US  
1N6642U & US  
1N6643U & US  
PER MIL-PRF-19500/578  
• SWITCHING DIODES  
• NON-CAVITY GLASS PACKAGE  
• METALLURGICALLY BONDED  
MAXIMUM RATINGS  
Operating Temperature: -65°C to +175°C  
Storage Temperature: -65°C to +175°C  
Operating Current: 300 mA  
Derating: 4.6 mA/°C Above T  
Surge Current: IFSM = 2.5A, half sine wave, P = 8.3ms  
= + 110°C  
EC  
w
MILLIMETERS  
INCHES  
DIM MIN  
MAX  
2.16  
0.71  
4.95  
MIN MAX  
0.070 0.085  
0.019 0.028  
0.165 0.195  
0.003MIN.  
D
F
G
1.78  
0.48  
4.19  
ELECTRICAL CHARACTERISTICS @ 25°C, unless otherwise specified.  
V
V
V
I
V
I
t
t
rr  
S
0.08MIN.  
BR  
@ I  
RWM  
F1  
F2  
@
F2  
fr  
TYPES  
I
I
= 10 mA  
I = 10 mA  
F
R
FM  
F
R
=100 µA  
=10 mA  
FIGURE 1  
(Pulsed)  
(Pulsed)  
=50 mA  
ns  
I
= 1 mA  
REC  
V (pk)  
V (pk)  
V dc  
V dc  
mA  
ns  
1N6638U & US  
1N6642U & US  
1N6643U & US  
150  
100  
75  
125  
75  
0.8  
0.8  
1.0  
1.1  
1.2  
1.2  
200  
100  
100  
20  
20  
20  
4.5  
5.0  
6.0  
DESIGN DATA  
50  
CASE: D-5D, Hermetically sealed glass  
case, per MIL-PRF- 19500/578  
LEAD FINISH: Tin / Lead  
I
I
I
I
C
C
R1  
R2  
V
R3  
R4  
T1  
T2  
TYPES  
THERMAL RESISTANCE: (R  
50 °C/W maximum at L = 0  
):  
OJEC  
V
V
= 20 V  
V
= V  
V
=
V
=
R
R
@
R
R
R
RWM  
R
= 20 V  
= V  
T
= 150°C  
T = 150°C  
A
0V  
1.5V  
RWM  
A
THERMAL IMPEDANCE: (Z  
°C/W maximum  
): 25  
nA dc  
µA dc  
µA dc  
µA dc  
pF  
pF  
JX  
O
1N6638U & US  
1N6642U & US  
1N6643U & US  
35  
25  
50  
0.5  
0.5  
0.5  
50  
50  
75  
100  
100  
160  
2.5  
5.0  
5.0  
2.0  
2.8  
2.8  
POLARITY: Cathode end is banded.  
MOUNTING SURFACE SELECTION:  
The Axial Coefficient of Expansion  
(COE) of this device is approximately  
+ 4PPM / °C. The COE of the Mounting  
Surface System should be selected to  
provide a suitable match with this  
device.  
6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841  
PHONE (978) 620-2600  
FAX (781) 689-0803  
WEBSITE: http://www.microsemi.com  
157  

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