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1N6624US PDF预览

1N6624US

更新时间: 2024-01-08 19:31:32
品牌 Logo 应用领域
美高森美 - MICROSEMI 二极管
页数 文件大小 规格书
4页 343K
描述
RECOVERY GLASS RECTIFIERS

1N6624US 技术参数

生命周期:ActiveReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.65Is Samacsys:N
外壳连接:ISOLATED配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
JESD-30 代码:O-LELF-R2元件数量:1
端子数量:2最大输出电流:1 A
封装主体材料:GLASS封装形状:ROUND
封装形式:LONG FORM最大重复峰值反向电压:900 V
最大反向恢复时间:0.05 µs表面贴装:YES
端子形式:WRAP AROUND端子位置:END
Base Number Matches:1

1N6624US 数据手册

 浏览型号1N6624US的Datasheet PDF文件第2页浏览型号1N6624US的Datasheet PDF文件第3页浏览型号1N6624US的Datasheet PDF文件第4页 
1N6620US thru 1N6625US  
S C O T T S D A L E D I V I S I O N  
RECOVERY GLASS RECTIFIERS  
DESCRIPTION  
APPEARANCE  
This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-  
19500/585 and is ideal for high-reliability applications where a failure cannot be  
tolerated. These industry-recognized 1.5 to 2.0 Amp rated rectifiers for working  
peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-  
glass construction using an internal “Category I” metallurgical bond. These devices  
are also available in axial-leaded packages for thru-hole mounting (see separate  
data sheet for 1N6620 thru 1N6625). Microsemi also offers numerous other rectifier  
products to meet higher and lower current ratings with various recovery time speed  
requirements including standard, fast and ultrafast device types in both through-hole  
and surface mount packages.  
Package “A”  
or D-5A  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount series equivalent to the JEDEC  
registered 1N6620 to 1N6625 series  
Ultrafast recovery rectifier series 200 to 1000 V  
Military and other high-reliability applications  
Switching power supplies or other applications  
requiring extremely fast switching & low forward  
loss  
High forward surge current capability  
Low thermal resistance  
Voidless hermetically sealed glass package  
Extremely robust construction  
Triple-layer passivation  
Internal “Category I” Metallurgical bonds  
JAN, JANTX, and JANTXV available per MIL-PRF-  
19500/585  
Controlled avalanche with peak reverse power  
capability  
Further options for screening in accordance with MIL-  
PRF-19500 for JANS by using a “MSP” prefix, e.g.  
MSP6620US, MSP6624US, etc.  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
Axial-leaded equivalents also available (see separate  
data sheet for 1N6620 thru 1N6625)  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Junction Temperature: -65oC to +175oC  
Storage Temperature: -65oC to +175oC  
CASE: Hermetically sealed voidless hard glass  
with Tungsten slugs  
Peak Forward Surge Current @ 25oC: 20 Amps (except  
TERMINATIONS: End caps are solid Silver (Ag)  
with Tin/Lead (Sn/Pb) finish  
1N6625 which is 15 Amps)  
MARKING: Cathode band only  
POLARITY: Cathode indicated by band  
Tape & Reel option: Standard per EIA-481-B  
Weight: 193 mg  
Note: Test pulse = 8.3 ms, half-sine wave.  
Average Rectified Forward Current (IO) at TEC=+110oC:  
1N6620 thru 1N6622: 2.0 Amps  
1N6623 thru 1N6625: 1.5 Amps  
(Derate linearly at 1.5%/oC for TEC > +110oC)  
Average Rectified Forward Current (IO) at TA=25oC:  
1N6620 thru 1N6622: 1.2 Amps  
See package dimensions and recommended pad  
layout on last page  
1N6623 thru 1N6625: 1.0 Amp  
(Derate linearly at 0.67%/ oC for TA>+25oC. This IO  
rating is typical for PC boards where thermal resistance  
from mounting point to ambient is sufficiently controlled  
where TJ(max) is not exceeded.)  
Thermal Resistance junction to endcap (RθJEC): 20oC/W  
Capacitance at VR= 10 V: 10 pF  
Solder temperature: 260oC for 10 s (maximum)  
Copyright © 2005  
6-19-2005 REV B  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

1N6624US 替代型号

型号 品牌 替代类型 描述 数据表
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