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1N6626_09 PDF预览

1N6626_09

更新时间: 2024-01-06 15:18:49
品牌 Logo 应用领域
美高森美 - MICROSEMI 整流二极管超快恢复二极管快速恢复二极管
页数 文件大小 规格书
4页 240K
描述
VOIDLESS-HERMETICALLY-SEALED ULTRA FAST RECOVERY GLASS RECTIFIERS

1N6626_09 数据手册

 浏览型号1N6626_09的Datasheet PDF文件第2页浏览型号1N6626_09的Datasheet PDF文件第3页浏览型号1N6626_09的Datasheet PDF文件第4页 
1N6626 thru 1N6631  
VOIDLESS-HERMETICALLY-SEALED  
ULTRA FAST RECOVERY GLASS  
RECTIFIERS  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-  
19500/590 and is ideal for high-reliability applications where a failure cannot be  
tolerated. These industry-recognized 2.0 to 4.0 Amp rated rectifiers for working  
peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-  
glass construction using an internal “Category I” metallurgical bond. These devices  
are also available in surface mount MELF package configurations by adding a “US”  
suffix (see separate data sheet for 1N6626US thru 1N6631US). Microsemi also  
offers numerous other rectifier products to meet higher and lower current ratings  
with various recovery time speed requirements including standard, fast and ultrafast  
device types in both through-hole and surface mount packages.  
“E” Package  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Popular JEDEC registered 1N6626 to 1N6631 series  
Voidless hermetically sealed glass package  
Extremely robust construction  
Ultrafast recovery rectifier series 200 to 1000 V  
Military and other high-reliability applications  
Switching power supplies or other applications  
requiring extremely fast switching & low forward  
loss  
High forward surge current capability  
Low thermal resistance  
Triple-layer passivation  
Internal “Category I” Metallurgical bonds  
JAN, JANTX, and JANTXV available per MIL-PRF-  
19500/590  
Controlled avalanche with peak reverse power  
capability  
Further options for screening in accordance with MIL-  
PRF-19500 for JANS by using a “SP” prefix, e.g. SP6626,  
SP6629, etc.  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
Surface mount equivalents also available in a square end-  
cap MELF configuration with “US” suffix (see separate  
data sheet for 1N6626US thru 1N6631US)  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Junction Temperature: -65oC to +150oC  
Storage Temperature: -65oC to +175oC  
CASE: Hermetically sealed voidless hard glass  
with Tungsten slugs  
Peak Forward Surge Current @ 25oC: 75A (except  
1N6631 which is 60A)  
TERMINATIONS: Axial-leads are Tin/Lead  
(Sn/Pb) over Copper.  
MARKING: Body painted and part number, etc.  
POLARITY: Cathode indicated by band  
Tape & Reel option: Standard per EIA-296  
Weight: 750 mg  
Note: Test pulse = 8.3ms, half-sine wave.  
Average Rectified Forward Current (IO) at TL= +75oC  
(L=.375 inch from body):  
1N6626 thru 1N6628  
1N6629 thru 1N6631  
2.3 A  
1.8 A  
See package dimensions on last page  
(Derate IO linearly at 1.0%/oC for TL> +75oC)  
Average Rectified Forward Current (IO) at TA=25oC:  
1N6626 thru 1N6628  
1N6629 thru 1N6631  
1.75 A  
1.40 A  
(Derate IO linearly at 0.80%/ oC for TA>+25oC. This IO  
rating is typical for PC boards where thermal resistance  
from mounting point to ambient is sufficiently controlled  
where TJ(max) is not exceeded. See MIL-PRF-19500/590)  
Thermal Resistance L= 0.375 inch (RθJL): 22oC/W  
Capacitance at VR= 10 V: 40 pF  
Solder temperature: 260oC for 10 s (maximum)  
Copyright © 2009  
10-01-2009 REV F; SA7-57.pdf  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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