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1N6626D3A PDF预览

1N6626D3A

更新时间: 2024-11-18 07:23:11
品牌 Logo 应用领域
SEME-LAB 二极管超快速恢复能力电源超快恢复二极管快速恢复二极管
页数 文件大小 规格书
4页 278K
描述
ULTRA FAST RECOVERY POWER RECTIFIER

1N6626D3A 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active包装说明:R-CDSO-N2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.68Is Samacsys:N
其他特性:HIGH RELIABILITY应用:ULTRA FAST RECOVERY POWER
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJESD-30 代码:R-CDSO-N2
最大非重复峰值正向电流:75 A元件数量:1
相数:1端子数量:2
最高工作温度:175 °C最低工作温度:-65 °C
最大输出电流:1.75 A封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最大重复峰值反向电压:200 V最大反向恢复时间:0.03 µs
表面贴装:YES端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

1N6626D3A 数据手册

 浏览型号1N6626D3A的Datasheet PDF文件第2页浏览型号1N6626D3A的Datasheet PDF文件第3页浏览型号1N6626D3A的Datasheet PDF文件第4页 
ULTRA FAST RECOVERY  
POWER RECTIFIER  
1N6626D3A / 1N6626D3B  
High Reliability Screening Options Available  
High forward current surge current capability  
Switching power supplies or other applications requiring  
fast switching and low forward loss  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
A
V
Working Peak Reverse Voltage  
200V  
RWM  
1
I
Average Rectified Forward Current T = 25°C  
A
1.75A  
O
2
I
Peak Forward Current Surge  
75A  
FSM  
T
T
T
Junction Temperature Range  
-65 to +175°C  
-65 to +175°C  
260°C  
J
Storage Temperature Range  
stg  
SP  
Maximum Soldering Pad Temperature for 20s  
THERMAL PROPERTIES  
Symbols  
Parameters  
Max.  
Units  
°C/W  
°C/W  
°C/W  
Thermal Resistance, Junction To Solder Pads T = 25°C  
SP  
R
40  
θJSP(IN)  
(3)  
(4)  
R
Thermal Resistance, Junction To Ambient, On PCB  
Thermal Resistance, Junction To Ambient, On PCB  
72.5  
110  
θJA(PCB)  
R
θJA(PCB)  
Notes  
(1) I  
is rated at 1.75A @ T = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where  
O1  
A
T (Max) does not exceed 175°C; This equates to R  
θJA(PCB)  
85°C/W.  
J
(2) T = 25°C @ IO=0A and VRWM = 0V for ten 8.3mS surges at 1 minute intervals.  
A
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.  
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.  
I
is rated at 1.5A @ T = 25°C for PC boards where R 111°C/W. Derate at 10mA/°C above T = 25°C in this case.  
θJA(PCB) A  
O1  
A
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.  
Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.  
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However  
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to  
verify that datasheets are current before placing an order.  
Semelab ltd  
Telephone +44 (0) 1455 556565  
Email: sales@semelab-tt.com  
Coventry Road, Lutterworth, Leicestershire, LE17 4JB  
Fax +44 (0) 1455 552612  
Website: http://www.semelab-tt.com  
Document Number 8975  
Issue 2  
Page 1 of 4  

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