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WF128K32N-60H1C5 PDF预览

WF128K32N-60H1C5

更新时间: 2024-09-15 20:34:39
品牌 Logo 应用领域
美高森美 - MICROSEMI 内存集成电路
页数 文件大小 规格书
11页 814K
描述
Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WF128K32N-60H1C5 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:PGA包装说明:PGA,
针数:66Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.53Is Samacsys:N
最长访问时间:60 ns其他特性:USER CONFIGURABLE AS 512K X 8
备用内存宽度:16JESD-30 代码:S-CPGA-P66
JESD-609代码:e4长度:27.3 mm
内存密度:4194304 bit内存集成电路类型:FLASH MODULE
内存宽度:32功能数量:1
端子数量:66字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX32封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:PGA封装形状:SQUARE
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED编程电压:5 V
认证状态:Not Qualified座面最大高度:4.6 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子面层:GOLD端子形式:PIN/PEG
端子节距:2.54 mm端子位置:PERPENDICULAR
处于峰值回流温度下的最长时间:NOT SPECIFIED类型:NOR TYPE
宽度:27.3 mmBase Number Matches:1

WF128K32N-60H1C5 数据手册

 浏览型号WF128K32N-60H1C5的Datasheet PDF文件第2页浏览型号WF128K32N-60H1C5的Datasheet PDF文件第3页浏览型号WF128K32N-60H1C5的Datasheet PDF文件第4页浏览型号WF128K32N-60H1C5的Datasheet PDF文件第5页浏览型号WF128K32N-60H1C5的Datasheet PDF文件第6页浏览型号WF128K32N-60H1C5的Datasheet PDF文件第7页 
WF128K32-XXX5  
128KX32 5V NOR FLASH MODULE (SMD 5962-94716**)  
FEATURES  
 Access times of 50*, 60, 70, 90, 120, 150ns  
 Low power CMOS  
 Packaging:  
 Embedded erase and program algorithms  
 TTL compatible inputs and CMOS outputs  
• 66 pin, PGA type, 1.075 inch square, Hermetic Ceramic  
HIP (Package 400)  
 Built-in decoupling caps and multiple ground pins for low  
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch)  
square, 3.56mm (0.140 inch) high (Package 510)  
noise operation  
 Page program operation and internal program control time  
 Weight  
• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880 inch)  
square, 4.06mm (0.160 inch) high (Package 528)  
WF128K32-XG2LX5 - 8 grams typical  
WF128K32-XG2UX5 - 8 grams typical  
WF128K32-XH1X5 - 13 grams typical  
 Sector architecture  
• 8 equal size sectors of 16KBytes each  
• Any combination of sectors can be concurrently erased.  
Also supports full chip erase  
This product is subject to change without notice.  
Note: For programming information and waveforms refer to Flash Programming 1M5 Application  
Note AN0036.  
 100,000 erase/program cycles minimum  
 Organized as 128Kx32  
* The access time of 50ns is available in Industrial and Commercial temperature ranges only.  
** For reference only. See SMD table on page 10.  
 Commercial, industrial and military temperature ranges  
 5 volt programming  
FIGURE 1 – PIN CONFIGURATION FOR WF128K32N-XH1X5  
Pin Description  
Top View  
I/O0-31  
Data Inputs/Outputs  
Address Inputs  
Write Enables  
Chip Selects  
A0-16  
I/O24  
I/O25  
I/O26  
A7  
VCC  
CS4#  
WE4#  
I/O27  
A4  
I/O31  
I/O30  
I/O29  
I/O28  
A1  
I/O8  
I/O9  
I/O10  
A14  
WE2#  
CS2#  
GND  
I/O11  
A10  
I/O15  
I/O14  
I/O13  
I/O12  
OE#  
NC  
WE1-4  
#
CS1-4  
OE#  
VCC  
#
Output Enable  
Power Supply  
Ground  
GND  
NC  
Not Connected  
A12  
A16  
Block Diagram  
NC  
A5  
A2  
A11  
A9  
WE1# CS1#  
WE2# CS2#  
WE3# CS3#  
WE4# CS4#  
128K x 8  
OE#  
A0-16  
A13  
A6  
A3  
A0  
A15  
WE1#  
I/O7  
A8  
WE3#  
CS3#  
GND  
I/O19  
I/O23  
I/O22  
I/O21  
I/O20  
NC  
I/O0  
I/O1  
I/O2  
VCC  
128K x 8  
128K x 8  
128K x 8  
I/O16  
I/O17  
I/O18  
CS1#  
NC  
I/O6  
8
8
8
8
I/O5  
I/O0-7  
I/O8-15  
I/O16-23  
I/O24-31  
I/O3  
I/O4  
Microsemi Corporation reserves the right to change products or specications without notice.  
June 2012 © 2012 Microsemi Corporation. All rights reserved.  
Rev. 12  
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com  

与WF128K32N-60H1C5相关器件

型号 品牌 获取价格 描述 数据表
WF128K32N-60H1C5A MICROSEMI

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Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-60H1I5 WEDC

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Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-60H1I5 MICROSEMI

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Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-60H1I5A WEDC

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Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-60H1M5 WEDC

获取价格

Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-60H1M5 MICROSEMI

获取价格

Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-60H1M5A MICROSEMI

获取价格

Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-60H1M5A WEDC

获取价格

Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-60H1Q5 WEDC

获取价格

Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-60H1Q5A WEDC

获取价格

Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66