Datasheet > WF128K32N-70G2LQ5A

WF128K32N-70G2LQ5A

更新时间： 2024-11-06 20:45:23

品牌	Logo	应用领域
WEDC		内存集成电路
页数	文件大小	规格书
15页	484K
描述
Flash Module, 128KX32, 70ns, CQFP68, 22.4 MM, CERAMIC, QFP-68

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WF128K32-XXX5

White Electronic Designs

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES

ꢀ

Commercial, Industrial and Military Temperature

Ranges

ꢀ

Access Times of 50**, 60, 70, 90, 120, 150ns

ꢀ

Packaging:

ꢀ

5 Volt Programming. 5V ± 10% Supply

Low Power CMOS, 1mA Standby Typical

Embedded Erase and Program Algorithms

TTL Compatible Inputs and CMOS Outputs

•

66 pin, PGA Type, 1.075 inch square, Hermetic

Ceramic HIP (Package 400)

68 lead, Hermetic CQFP (G2U), 22.4mm

(0.880 inch) square, 3.56mm (0.140 inch) high

(Package 510)

Built-in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

•

68 lead, Hermetic CQFP (G2L), 22.4mm

(0.880 inch) square, 4.06mm (0.160 inch) high

(Package 528)

ꢀ

Page Program Operation and Internal Program

Control Time

ꢀ

Sector Architecture

Weight

WF128K32-XG2LX5 - 8 grams typical

WF128K32-XG2UX5 - 8 grams typical

WF128K32-XH1X5 - 13 grams typical

•

8 equal size sectors of 16KBytes each

Any combination of sectors can be concurrently

erased. Also supports full chip erase

ꢀ

100,000 Erase/Program Cycles Typical, 0°C to

+70°C

Note: For programming information refer to Flash Programming 1M5 Application Note.

Organized as 128Kx32

* This product is subject to change without notice.

* * The access time of 50ns is available in Industrial and Commercial temperature

ranges only.

FIGURE 1 – PIN CONFIGURATION FOR WF128K32N-XH1X5

Top View

Pin Description

I/O_0-31

A_0-16

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

I/O24

I/O31

I/O30

I/O29

I/O28

I/O

I/O15

I/O14

I/O13

I/O12

OE#

WE_1-4

I/O25

I/O26

CS4

CS2

CS_1-4

OE#

V_CC

Output Enable

Power Supply

Ground

WE4

I/O10

GND

I/O11

I/O27

A14

A16

A11

GND

A12

Not Connected

Block Diagram

A13

WE1#

4 4

WE # CS #

OE#

I/O23

I/O22

I/O21

I/O20

I/O

0-16

I/O16

I/O17

I/O18

I/O

128K x 8

GND

I/O¹⁹

I/O^0-7

I/O^8-15

I/O^16-23

I/O^24-31

March 2006

Rev. 8

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7...15

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与WF128K32N-70G2LQ5A相关器件

型号	品牌	获取价格	描述	数据表
WF128K32N-70G2UC5	WEDC	获取价格	Flash Module, 128KX32, 70ns, CQFP68, 22.4 MM, CERAMIC, QFP-68
WF128K32N-70G2UC5A	MICROSEMI	获取价格	Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68
WF128K32N-70G2UI5A	WEDC	获取价格	Flash Module, 128KX32, 70ns, CQFP68, 22.4 MM, CERAMIC, QFP-68
WF128K32N-70G2UM5	WEDC	获取价格	Flash Module, 128KX32, 70ns, CQFP68, 22.4 MM, CERAMIC, QFP-68
WF128K32N-70G2UM5A	WEDC	获取价格	Flash Module, 128KX32, 70ns, CQFP68, 22.4 MM, CERAMIC, QFP-68
WF128K32N-70G2UQ5	MICROSEMI	获取价格	Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68
WF128K32N-70G2UQ5A	MICROSEMI	获取价格	Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68
WF128K32N-70H1C5	MICROSEMI	获取价格	Flash Module, 128KX32, 70ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-70H1C5A	MICROSEMI	获取价格	Flash Module, 128KX32, 70ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WF128K32N-70H1I5	WEDC	获取价格	Flash Module, 128KX32, 70ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

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