是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | PGA | 包装说明: | PGA, |
针数: | 66 | Reach Compliance Code: | unknown |
ECCN代码: | 3A001.A.2.C | HTS代码: | 8542.32.00.51 |
风险等级: | 5.53 | Is Samacsys: | N |
最长访问时间: | 60 ns | 其他特性: | USER CONFIGURABLE AS 512K X 8 |
备用内存宽度: | 16 | JESD-30 代码: | S-CPGA-P66 |
长度: | 27.3 mm | 内存密度: | 4194304 bit |
内存集成电路类型: | FLASH MODULE | 内存宽度: | 32 |
功能数量: | 1 | 端子数量: | 66 |
字数: | 131072 words | 字数代码: | 128000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 128KX32 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | PGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
编程电压: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 4.6 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | PIN/PEG |
端子节距: | 2.54 mm | 端子位置: | PERPENDICULAR |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 类型: | NOR TYPE |
宽度: | 27.3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WF128K32N-60H1Q5 | WEDC |
获取价格 |
Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | |
WF128K32N-60H1Q5A | WEDC |
获取价格 |
Flash Module, 128KX32, 60ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | |
WF128K32N-60HI5 | ETC |
获取价格 |
x32 Flash EEPROM Module | |
WF128K32N-60HM5 | ETC |
获取价格 |
x32 Flash EEPROM Module | |
WF128K32N-70G2LC5 | WEDC |
获取价格 |
Flash Module, 128KX32, 70ns, CQFP68, 22.4 MM, CERAMIC, QFP-68 | |
WF128K32N-70G2LC5A | MICROSEMI |
获取价格 |
Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68 | |
WF128K32N-70G2LI5 | MICROSEMI |
获取价格 |
Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68 | |
WF128K32N-70G2LM5A | WEDC |
获取价格 |
Flash Module, 128KX32, 70ns, CQFP68, 22.4 MM, CERAMIC, QFP-68 | |
WF128K32N-70G2LQ5 | MICROSEMI |
获取价格 |
Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68 | |
WF128K32N-70G2LQ5A | MICROSEMI |
获取价格 |
Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68 |