是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | QFP |
包装说明: | FQFP, | 针数: | 128 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.83 | 其他特性: | ALSO OPERATES AT 5V SUPPLY |
地址总线宽度: | 4 | 边界扫描: | NO |
总线兼容性: | PC-AT; PS/2; LPC | 最大时钟频率: | 48 MHz |
外部数据总线宽度: | 4 | JESD-30 代码: | R-PQFP-G128 |
长度: | 20 mm | I/O 线路数量: | 54 |
端子数量: | 128 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | FQFP | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK, FINE PITCH | 峰值回流温度(摄氏度): | 225 |
认证状态: | Not Qualified | RAM(字数): | 256 |
座面最大高度: | 3.32 mm | 最大供电电压: | 3.63 V |
最小供电电压: | 2.97 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 14 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
W83627G-AW | WINBOND |
功能相似 |
Winbond LPC I/O | |
W83627EHG | WINBOND |
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evolving product from Winbonds most popular I/O family | |
W83627F-AW | WINBOND |
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Winbond LPC I/O |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
W83627EEG | WINBOND |
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evolving product from Winbonds most popular I/O family | |
W83627EG | WINBOND |
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Multifunction Peripheral, CMOS, PQFP128, PLASTIC, QFP-128 | |
W83627EHF | WINBOND |
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evolving product from Winbonds most popular I/O family | |
W83627EHF_0611 | WINBOND |
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WINBOND LPC I/O | |
W83627EHG | WINBOND |
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evolving product from Winbonds most popular I/O family | |
W83627F | WINBOND |
获取价格 |
WINBOND I/O | |
W83627F-AW | WINBOND |
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Winbond LPC I/O | |
W83627F-PW | WINBOND |
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Multifunction Peripheral, CMOS, PQFP128, PLASTIC, QFP-128 | |
W83627G | WINBOND |
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Winbond LPC I/O | |
W83627G-AW | WINBOND |
获取价格 |
Winbond LPC I/O |