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W39F010T-90B PDF预览

W39F010T-90B

更新时间: 2024-11-06 03:17:51
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
33页 213K
描述
128K 】 8 CMOS FLASH MEMORY

W39F010T-90B 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP包装说明:8 X 20 MM, TSOP-32
针数:32Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.87最长访问时间:90 ns
启动块:BOTTOM/TOP命令用户界面:YES
数据轮询:YES耐久性:10000 Write/Erase Cycles
JESD-30 代码:R-PDSO-G32长度:18.4 mm
内存密度:1048576 bit内存集成电路类型:FLASH
内存宽度:8湿度敏感等级:1
功能数量:1部门数/规模:32
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP32,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):225
电源:5 V编程电压:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
部门规模:4K最大待机电流:0.00005 A
子类别:Flash Memories最大压摆率:0.03 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:YES类型:NOR TYPE
宽度:8 mmBase Number Matches:1

W39F010T-90B 数据手册

 浏览型号W39F010T-90B的Datasheet PDF文件第2页浏览型号W39F010T-90B的Datasheet PDF文件第3页浏览型号W39F010T-90B的Datasheet PDF文件第4页浏览型号W39F010T-90B的Datasheet PDF文件第5页浏览型号W39F010T-90B的Datasheet PDF文件第6页浏览型号W39F010T-90B的Datasheet PDF文件第7页 
W39F010  
128K × 8 CMOS FLASH MEMORY  
Table of Contents-  
1.  
2.  
3.  
4.  
5.  
6.  
GENERAL DESCRIPTION ......................................................................................................... 3  
FEATURES................................................................................................................................. 3  
PIN CONFIGURATIONS ............................................................................................................ 4  
BLOCK DIAGRAM ...................................................................................................................... 5  
PIN DESCRIPTION..................................................................................................................... 6  
FUNCTIONAL DESCRIPTION ................................................................................................... 7  
6.1  
Device Bus Operation..................................................................................................... 7  
6.1.1  
6.1.2  
6.1.3  
6.1.4  
Read Mode...............................................................................................................7  
Write Mode ...............................................................................................................7  
Standby Mode ..........................................................................................................7  
Output Disable Mode................................................................................................7  
6.2  
6.3  
Data Protection............................................................................................................... 7  
Boot Block Operation...................................................................................................... 8  
6.3.1  
6.3.2  
6.3.3  
6.3.4  
Low VDD Inhibit........................................................................................................8  
Write Pulse "Glitch" Protection .................................................................................8  
Logical Inhibit............................................................................................................8  
Power-up Write Inhibit ..............................................................................................8  
6.4  
6.5  
Command Definitions ..................................................................................................... 8  
6.4.1  
6.4.2  
6.4.3  
6.4.4  
6.4.5  
Read Command .......................................................................................................9  
Auto-select Command ..............................................................................................9  
Byte Program Command ..........................................................................................9  
Chip Erase Command ............................................................................................10  
Page Erase Command ...........................................................................................10  
Write Operation Status ................................................................................................. 10  
6.5.1  
6.5.2  
DQ7: Data Polling...................................................................................................10  
DQ6: Toggle Bit......................................................................................................11  
7.  
TABLE OF OPERATING MODES ............................................................................................ 12  
7.1  
7.2  
7.3  
7.4  
7.5  
7.6  
7.7  
Device Bus Operations................................................................................................. 12  
Command Definitions ................................................................................................... 12  
Embedded Programming Algorithm ............................................................................. 14  
Embedded Erase Algorithm.......................................................................................... 15  
Embedded #Data Polling Algorithm.............................................................................. 16  
Boot Block Lockout Enable Flow Chart ........................................................................ 17  
Software Product Identification and Boot Block Lockout Detection Flow Chart........... 18  
Publication Release Date: December 26, 2005  
- 1 -  
Revision A4  

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