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W39L010Q-90 PDF预览

W39L010Q-90

更新时间: 2024-11-19 22:08:47
品牌 Logo 应用领域
华邦 - WINBOND 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
27页 721K
描述
128K X 8 CMOS FLASH MEMORY

W39L010Q-90 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP包装说明:TSSOP, TSSOP32,.56,20
针数:32Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.87最长访问时间:90 ns
命令用户界面:YES数据轮询:YES
JESD-30 代码:R-PDSO-G32JESD-609代码:e0
长度:12.4 mm内存密度:1048576 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1部门数/规模:32
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX8封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP32,.56,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V编程电压:3.3 V
认证状态:Not Qualified座面最大高度:1.2 mm
部门规模:4K最大待机电流:0.00005 A
子类别:Flash Memories最大压摆率:0.03 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN LEAD端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:YES
类型:NOR TYPE宽度:8 mm
Base Number Matches:1

W39L010Q-90 数据手册

 浏览型号W39L010Q-90的Datasheet PDF文件第2页浏览型号W39L010Q-90的Datasheet PDF文件第3页浏览型号W39L010Q-90的Datasheet PDF文件第4页浏览型号W39L010Q-90的Datasheet PDF文件第5页浏览型号W39L010Q-90的Datasheet PDF文件第6页浏览型号W39L010Q-90的Datasheet PDF文件第7页 
W39L010  
128K × 8 CMOS FLASH MEMORY  
Table of Contents-  
1.  
2.  
3.  
4.  
5.  
6.  
GENERAL DESCRIPTION ......................................................................................................... 3  
FEATURES................................................................................................................................. 3  
PIN CONFIGURATIONS ............................................................................................................ 4  
BLOCK DIAGRAM ...................................................................................................................... 4  
PIN DESCRIPTION..................................................................................................................... 4  
FUNCTIONAL DESCRIPTION ................................................................................................... 5  
6.1  
Device Bus Operation..................................................................................................... 5  
6.1.1 Read Mode.......................................................................................................................5  
6.1.2 Write Mode.......................................................................................................................5  
6.1.3 Standby Mode ..................................................................................................................5  
6.1.4 Output Disable Mode........................................................................................................5  
6.1.5 Auto-select Mode..............................................................................................................5  
6.2  
6.3  
Data Protection............................................................................................................... 6  
6.2.1 Boot Block Operation........................................................................................................6  
6.2.2 Write Pulse "Glitch" Protection .........................................................................................6  
6.2.3 Logical Inhibit ...................................................................................................................6  
6.2.4 Power-up Write Inhibit ......................................................................................................6  
Command Definitions ..................................................................................................... 7  
6.3.1 Read Command ...............................................................................................................7  
6.3.2 Auto-select Command......................................................................................................7  
6.3.3 Byte Program Command..................................................................................................7  
6.3.4 Chip Erase Command ......................................................................................................8  
6.3.5 Page Erase Command .....................................................................................................8  
6.4  
Write Operation Status ................................................................................................... 9  
6.4.1 DQ7: Data Polling.............................................................................................................9  
6.4.2 DQ6: Toggle Bit................................................................................................................9  
7.  
TABLE OF OPERATING MODES ............................................................................................ 10  
7.1  
7.2  
7.3  
7.4  
7.5  
7.6  
7.7  
Device Bus Operations................................................................................................. 10  
Auto-select Codes (High Voltage Method)................................................................... 10  
Command Definitions ................................................................................................... 11  
Embedded Programming Algorithm ............................................................................. 12  
Embedded Erase Algorithm.......................................................................................... 13  
Embedded #Data Polling Algorithm.............................................................................. 14  
Embedded Toggle Bit Algorithm................................................................................... 14  
Publication Release Date: January 9, 2004  
- 1 -  
Revision A4  

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