UPS3540
5 A Schottky Barrier Rectifier
KEY FEATURES
DESCRIPTION
In Microsemi’s new Powermite3® SMT
In addition to its size advantages,
ꢀ High power surface mount
package, these high efficiency ultrafast Powermite3® package features include a full
package.
ꢀ Guard Ring die construction for
transient protection.
rectifiers offer the power handing
capabilities previously found only in
much larger packages. They are ideal
for SMD applications that operate at
high frequencies.
metallic bottom that eliminates the
possibility of solder flux entrapment during
assembly, and a unique locking tab acts as
an integral heat sink. Its innovative design
makes this device ideal for use with
automatic insertion equipment.
ꢀ Silicon Schottky rectifiers no
reverse voltage recovery.
ꢀ Internal heat sink locking tabs
ꢀ Low forward voltage.
ꢀ Full metallic bottom eliminates
flux entrapment
ꢀ Compatible with automatic
insertion equipment
IMPORTANT: For themost current data, consultMICROSEMI’s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
ꢀ Low profile-maximum height of
1mm supplied in 16 mm tape
reel- 5000 units/ 13” reel.
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
VRRM
VRWM
VR
V R (RMS)
Io
40
V
APPLICATIONS/BENEFITS
ꢀ Switching and Regulating Power
Supplies.
28
5
V
A
ꢀ Charge Pump Circuits.
ꢀ Reduces reverse recovery loss
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave Superimposed
on Rated Load@ Tc =90 ºC
IFSM
100
A
due to low IRM
.
ꢀ Small foot print
190 X 300 mils
1:1 Actual size
Storage Temperature
T stg
T op
-55 to +150
-55 to +125
ºC
ºC
Operating Temperature
THERMAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED)
Thermal Resistance
Junction-to Bottom
Rja (1)
3.2
ºC/Watt
(1) When Mounted on PC board with 2 ounce copper pattern.
Copyright 2003
Microsemi
Page 1
Rev. 0., 2003-02-13