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SMMS706A − MARCH 1998 − REVISED APRIL 1998
D
D
Organization:
− TM2SN64EPH . . . 2 097 152 x 64 Bits
− TM4SN64EPH . . . 4 194 304 x 64 Bits
D
High-Speed, Low-Noise, Low-Voltage TTL
(LVTTL) Interface
D
Read Latencies 2 and 3 Supported
Single 3.3-V Power Supply
( 10% Tolerance)
D
Support Burst-Interleave and
Burst-Interrupt Operations
D
Designed for 66-MHz 4-Clock Systems
D
D
D
D
D
D
Burst Length Programmable to 1, 2, 4,
and 8
D
JEDEC 168-Pin Dual-In-Line Memory
Module (DIMM) Without Buffer for Use With
Socket
Two Banks for On-Chip Interleaving
(Gapless Access)
D
D
TM2SN64EPH — Uses Eight 16M-Bit
Synchronous Dynamic RAMs (SDRAMs)
(2M × 8-Bit) in Plastic Thin Small-Outline
Packages (TSOPs)
Ambient Temperature Range
0°C to 70°C
Gold-Plated Contacts
Pipeline Architecture
TM4SN64EPH — Uses Sixteen 16M-Bit
SDRAMs (2M × 8-Bit) in Plastic TSOPs
Byte-Read/Write Capability
Serial Presence Detect (SPD) Using
EEPROM
D
D
Performance Ranges:
SYNCHRONOUS
CLOCK CYCLE
TIME
ACCESS TIME
CLOCK TO
OUTPUT
REFRESH
INTERVAL
t
t
t
t
AC2
CK3
CK2
AC3
†
(CL = 3)
(CL = 2) (CL = 3) (CL = 2)
’xSN64EPH-10
10 ns
15 ns 7.5 ns 7.5 ns
64 ms
†
CL = CAS latency
description
The TM2SN64EPH is a 16M-byte, 168-pin dual-in-line memory module (DIMM). The DIMM is composed of
eight TMS626812BDGE, 2097152 x 8-bit SDRAMs, each in a 400-mil, 44-pin plastic thin small-outline package
(TSOP) mounted on a substrate with decoupling capacitors. See the TMS626812B data sheet (literature
number SMOS693).
The TM4SN64EPH is a 32M-byte, 168-pin DIMM. The DIMM is composed of sixteen TMS626812BDGE,
2097152 x 8-bit SDRAMs, each in a 400-mil, 44-pin plastic TSOP mounted on a substrate with decoupling
capacitors.
operation
The TM2SN64EPH operates as eight TMS626812BDGE devices that are connected as shown in the
TM2SN64EPH functional block diagram. The TM4SN64EPH operates as sixteen TMS626812BDGE devices
connected as shown in the TM4SN64EPH functional block diagram.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 1998, Texas Instruments Incorporated
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