TK12P60W
Silicon N Channel MOS Type (DTMOSⅣ)
Switching Regulator Applications
Unit: mm
6.6 ± 0.2
5.34 ± 0.13
•
Low drain-source ON-resistance : R
by used to Super Junction Structure : DTMOS
= 0.256Ω (typ.)
DS (ON)
0.58MAX
•
•
Easy to control Gate switching
Enhancement-mode: V = 2.7 to 3.7 V (V
= 10 V, I = 0.6 mA)
D
th
DS
Absolute Maximum Ratings (Ta = 25°C)
1.14MAX
2.29
Characteristics
Drain-source voltage
Symbol
Rating
Unit
0.76 ± 0.12
V
V
600
±30
11.5
46.0
100
V
V
DSS
Gate-source voltage
GSS
Drain current (Continuous)
Drain current (Pulsed)
(Note 1)
(Note 1)
I
A
D
1
2
3
I
A
DP
1. GATE
2. DRAIN
(HEAT SINK)
3. SOURCE
Drain power dissipation (Tc = 25°C)
P
W
D
AS
AR
Single pulse avalanche energy
E
93
mJ
(Note 2)
JEDEC
JEITA
⎯
⎯
Avalanche current
I
I
5.8
A
A
Drain reverse current (Continuous)
11.5
DR
(Note 1)
TOSHIBA
2-7K1A
Drain reverse current (Pulsed) (Note 1)
Channel temperature
I
46.0
150
A
DRP
Weight : 0.36 g (typ.)
T
°C
°C
ch
Storage temperature range
T
-55 to 150
stg
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook (“Handling Precautions”/“Derating Concept and Methods’’) and individual reliability data (i.e.
reliability test report and estimated failure rate, etc).
Internal Connection
Thermal Characteristics
Characteristics
Symbol
Max
1.25
Unit
2
Thermal resistance, channel to case
R
°C/W
th (ch-c)
Note 1: Ensure that the channel temperature does not exceed 150°C.
Note 2: = 90 V, T = 25°C (initial), L = 4.83 mH, R = 25 Ω, I = 5.8 A
AR
V
DD
ch
G
1
This transistor is an electrostatic-sensitive device. Handle with care.
3
1/5
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