P+N-Channel Enhancement Mode MOSFET
TGBLH6601-S8
Electrical Characteristics-P (@ TA = 25°C unless otherwise specified)
Symbol
Parameter
Test Condition
Min. Typ. Max. Unit
Static Characteristics
VDSS
IDSS
IGSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = -250μA
VDS = -60V, VGS = 0V
VGS = ±20V, VDS = 0V
-60
-
-
-
-
V
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
-
-
-1
μA
nA
±1 00
On Characteristics
RDS(ON)
Static Drain-Source On-resistance *3
VGS = -10V, ID = -4A
VGS = -4.5V, ID = -4A
VDS = VGS, ID = -250μA
-
-
70
90
135
-3
mΩ
mΩ
V
100
-1.6
VGS(th)
Gate Threshold Voltage
-1
Dynamic Characteristics
CISS
COSS
CRSS
Input Capacitance
-
-
-
930
55
-
-
-
VGS = 0V
Output Capacitance
VDS = -30V
f = 1.0MHz
pF
Reverse Transfer Capacitance
41
Switching Characteristics
td(ON)
tr
td(OFF)
tf
Turn-on Delay Time *5
Turn-on Rise Time *5
Turn-Off Delay Time *5
Turn-Off Fall Time *5
Total Gate-Charge
8
4
VDD = -30V
VGS = -10V
RG = 3Ω
ns
32
7
RL = 7.5Ω
QG
-
-
-
20
3.1
3.2
-
-
-
VGS = -10V
VDD = -30V
ID = -4A
QGS
QGD
Gate to Source Charge
Gate to Drain (Miller) Charge
nC
Source-Drain Diode Characteristics
VSD
trr
Diode Forward Voltage *3
Reverse Recovery Time
Reverse Recovery Charge
ISD = -1A, VGS = 0V
-
-0.7
23
-1.2
V
ns
nC
IF = -4A, VGS = 0V
dI/dt = 100A/μs
Qrr
11
Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper
2. The data tested by surface mounted on a minimum recommended FR-4 board
3. The data tested by pulsed, pulse width ≤ 300μs, duty cycle ≤ 2%
4. The EAS data shows Max. rating. The test condition is N: VDD = 30V, VGS = 10V, L = 0.5mH
P: VDD = -30V, VGS = -10V, L = 0.5mH
5. Guaranteed by design, not subject to production
MTM0933A: December 2023 [2.0]
www.gmesemi.com
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