MMSZ4xxxET1 Series,
SZMMSZ4xxxET1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
Features
1
2
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 1.8 V to 43 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 x 20 ms)
Cathode
Anode
SOD−123
CASE 425
STYLE 1
2
• AEC−Q101 Qualified and PPAP Capable
1
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
• Pb−Free Packages are Available
MARKING DIAGRAM
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
xxx M G
1
G
xxx = Device Code (Refer to page 2)
M
G
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
MAXIMUM RATINGS
†
Rating
Symbol
Max
Unit
Device
Package
Shipping
Peak Power Dissipation @ 20 ms (Note 1)
P
pk
225
W
MMSZ4xxxET1
SOD−123
3000 / Tape &
Reel
@ T ≤ 25°C
L
Total Power Dissipation on FR−5 Board,
P
D
MMSZ4xxxET1G
SOD−123
(Pb−Free)
3000 / Tape &
Reel
(Note 2) @ T = 75°C
500
6.7
mW
mW/°C
L
Derated above 75°C
SZMMSZ4xxxET1G SOD−123
(Pb−Free)
3000 / Tape &
Reel
Thermal Resistance, (Note 3)
Junction−to−Ambient
R
340
°C/W
°C/W
°C
q
JA
MMSZ4xxxET3
SOD−123
10000 / Tape &
Reel
Thermal Resistance, (Note 3)
Junction−to−Lead
R
q
JL
150
MMSZ4xxxET3G
SOD−123
(Pb−Free)
10000 / Tape &
Reel
Junction and Storage Temperature Range
T , T
J
−55 to
+150
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 11.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
2. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.
3. Thermal Resistance measurement obtained via infrared Scan Method.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
November, 2011 − Rev. 5
MMSZ4678ET1/D