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SZMMSZ4706T1G PDF预览

SZMMSZ4706T1G

更新时间： 2024-01-25 11:44:22
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管
页数 文件大小 规格书
6页 119K
描述
19 V, 0.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, ROHS COMPLIANT, PLASTIC, CASE 425-04, 2 PIN

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SZMMSZ4706T1G 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：R-PDSO-G2Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.79配置：SINGLE
二极管元件材料：SILICON二极管类型：ZENER DIODE
JESD-30 代码：R-PDSO-G2元件数量：1
端子数量：2最高工作温度：150 °C
最低工作温度：-55 °C封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260极性：UNIDIRECTIONAL
最大功率耗散：0.5 W参考标准：AEC-Q101
标称参考电压：19 V表面贴装：YES
技术：ZENER端子形式：GULL WING
端子位置：DUAL处于峰值回流温度下的最长时间：10
最大电压容差：5%工作测试电流：0.05 mA
Base Number Matches：1

SZMMSZ4706T1G 数据手册

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MMSZ4xxxT1G Series,  
SZMMSZ4xxxT1G Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Features  
• 500 mW Rating on FR−4 or FR−5 Board  
• Wide Zener Reverse Voltage Range − 1.8 V to 43 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• ESD Rating of Class 3 (> 16 kV) per Human Body Model  
SOD−123  
CASE 425  
STYLE 1  
• SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
1
2
Cathode  
Anode  
• These Devices are Pb−Free and are RoHS Compliant*  
MARKING DIAGRAM  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
xx M G  
1
G
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
xx = Device Code (Refer to page 3)  
M
= Date Code  
G
= Pb−Free Package  
MAXIMUM RATINGS  
(Note: Microdot may be in either location)  
Rating  
Symbol  
Max  
Units  
Total Power Dissipation on FR−5 Board,  
P
D
ORDERING INFORMATION  
(Note 1) @ T = 75°C  
500  
6.7  
mW  
mW/°C  
L
†
Derated above 75°C  
Device  
Package  
Shipping  
MMSZ4xxxT1G  
SOD−123  
(Pb−Free)  
3,000 /  
Tape & Reel  
Thermal Resistance, (Note 2)  
R
°C/W  
°C/W  
°C  
q
JA  
Junction−to−Ambient  
340  
150  
SZMMSZ4xxxT1G SOD−123  
(Pb−Free)  
3,000 /  
Tape & Reel  
Thermal Resistance, (Note 2)  
Junction−to−Lead  
R
q
JL  
MMSZ4xxxT3G  
SOD−123  
(Pb−Free)  
10,000 /  
Tape & Reel  
Junction and Storage Temperature Range  
T , T  
J
−55 to  
+150  
stg  
SZMMSZ4xxxT3G SOD−123  
(Pb−Free)  
10,000 /  
Tape & Reel  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
November, 2013 − Rev. 10  
MMSZ4678T1/D  
 
123456

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