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SZMMSZ4717ET1G PDF预览

SZMMSZ4717ET1G

更新时间: 2024-02-13 19:29:32
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安森美 - ONSEMI /
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SZMMSZ4717ET1G 数据手册

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MMSZ4xxxET1G Series,  
SZMMSZ4xxxET1G Series  
Zener Voltage Regulators  
500 mW SOD123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD123 package. These devices provide a  
convenient alternative to the leadless 34package style.  
http://onsemi.com  
Features  
500 mW Rating on FR4 or FR5 Board  
Wide Zener Reverse Voltage Range 1.8 V to 43 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
Peak Power 225 W (8 x 20 ms)  
SOD123  
CASE 425  
STYLE 1  
1
2
AECQ101 Qualified and PPAP Capable  
Cathode  
Anode  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
MARKING DIAGRAM  
PbFree Packages are Available*  
Mechanical Characteristics:  
xxx M G  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260C for 10 Seconds  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V0  
1
G
xxx = Device Code (Refer to page 2)  
M
G
= Date Code  
= PbFree Package  
(Note: Microdot may be in either location)  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
ORDERING INFORMATION  
Peak Power Dissipation @ 20 ms (Note 1)  
P
pk  
225  
W
Device  
Package  
Shipping  
@ T 25C  
L
MMSZ4xxxET1G  
SOD123  
(PbFree)  
3,000 /  
Tape & Reel  
Total Power Dissipation on FR5 Board,  
P
D
(Note 2) @ T = 75C  
500  
6.7  
mW  
L
Derated above 75C  
mW/C  
SZMMSZ4xxxET1G SOD123  
(PbFree)  
3,000 /  
Tape & Reel  
Thermal Resistance, (Note 3)  
JunctiontoAmbient  
R
C/W  
C/W  
C  
q
JA  
340  
150  
MMSZ4xxxET3G  
SOD123  
(PbFree)  
10,000 /  
Tape & Reel  
Thermal Resistance, (Note 3)  
JunctiontoLead  
R
q
JL  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Junction and Storage Temperature Range  
T , T  
55 to  
+150  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Nonrepetitive current pulse per Figure 11.  
2. FR5 = 3.5 x 1.5 inches, using the minimum recommended footprint.  
3. Thermal Resistance measurement obtained via infrared Scan Method.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
January, 2012 Rev. 6  
MMSZ4678ET1/D  
 

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