MMSZxxxT1 Series,
SZMMSZxxxT1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
Features
1
2
Cathode
Anode
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 2.4 V to 56 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• AEC−Q101 Qualified and PPAP Capable
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
2
1
SOD−123
CASE 425
STYLE 1
• Pb−Free Packages are Available
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MARKING DIAGRAM
xx M G
1
G
xx = Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
ORDERING INFORMATION
Total Power Dissipation on FR−5 Board,
P
D
(Note 1) @ T = 75°C
500
6.7
mW
mW/°C
L
†
Device
Package
Shipping
Derated above 75°C
Thermal Resistance, Junction−to−Ambient
R
340
°C/W
°C/W
°C
MMSZxxxT1
SOD−123 3000/Tape & Reel
(Pb−Free)
q
JA
(Note 2)
Thermal Resistance, Junction−to−Lead
(Note 2)
R
JL
150
q
SZMMSZxxxT1G SOD−123 3000/Tape & Reel
(Pb−Free)
Junction and Storage Temperature Range T , T
−55 to +150
MMSZxxxT3
SOD−123
(Pb−Free)
10,000/Tape &
Reel
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 3.5 X 1.5 inches.
SZMMSZxxxT3G SOD−123
(Pb−Free)
10,000/Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
2. Thermal Resistance measurement obtained via infrared Scan Method.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
November, 2011 − Rev. 10
MMSZ2V4T1/D