MMSZ4xxxET1G Series,
SZMMSZ4xxxET1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
Features
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 1.8 V to 43 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Peak Power − 225 W (8 x 20 ms)
SOD−123
CASE 425
STYLE 1
1
2
AEC−Q101 Qualified and PPAP Capable
Cathode
Anode
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
MARKING DIAGRAM
Pb−Free Packages are Available*
Mechanical Characteristics:
xxx M G
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
1
G
xxx = Device Code (Refer to page 2)
M
G
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
ORDERING INFORMATION
Peak Power Dissipation @ 20 ms (Note 1)
P
pk
225
W
†
Device
Package
Shipping
@ T 25C
L
MMSZ4xxxET1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel
Total Power Dissipation on FR−5 Board,
P
D
(Note 2) @ T = 75C
500
6.7
mW
L
Derated above 75C
mW/C
SZMMSZ4xxxET1G SOD−123
(Pb−Free)
3,000 /
Tape & Reel
Thermal Resistance, (Note 3)
Junction−to−Ambient
R
C/W
C/W
C
q
JA
340
150
MMSZ4xxxET3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel
Thermal Resistance, (Note 3)
Junction−to−Lead
R
q
JL
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Junction and Storage Temperature Range
T , T
−55 to
+150
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 11.
2. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.
3. Thermal Resistance measurement obtained via infrared Scan Method.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
January, 2012 − Rev. 6
MMSZ4678ET1/D