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STB22NM50T4 PDF预览

STB22NM50T4

更新时间: 2024-11-15 14:45:03
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 开关脉冲晶体管
页数 文件大小 规格书
10页 356K
描述
20A, 500V, 0.215ohm, N-CHANNEL, Si, POWER, MOSFET, D2PAK-3

STB22NM50T4 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:not_compliant风险等级:5.69
雪崩能效等级(Eas):650 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):20 A
最大漏极电流 (ID):20 A最大漏源导通电阻:0.215 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):192 W最大脉冲漏极电流 (IDM):80 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

STB22NM50T4 数据手册

 浏览型号STB22NM50T4的Datasheet PDF文件第2页浏览型号STB22NM50T4的Datasheet PDF文件第3页浏览型号STB22NM50T4的Datasheet PDF文件第4页浏览型号STB22NM50T4的Datasheet PDF文件第5页浏览型号STB22NM50T4的Datasheet PDF文件第6页浏览型号STB22NM50T4的Datasheet PDF文件第7页 
STP22NM50 - STP22NM50FP  
STB22NM50 - STB22NM50-1  
2
2
N-CHANNEL 500V - 0.16- 20A TO-220/FP/D PAK/I PAK  
MDmesh™Power MOSFET  
ADVANCED DATA  
TYPE  
V
R
R
*Q  
ds(on)  
I
D
DSS  
DS(on)  
g
STP22NM50  
STP22NM50FP  
STB22NM50  
STB22NM50-1  
500 V <0.2156.4 *nC  
500 V <0.2156.4 *nC  
500 V <0.2156.4 *nC  
500 V <0.2156.4 *nC  
20 A  
20 A  
20 A  
20 A  
3
1
3
2
2
D PAK  
1
TYPICAL R (on) = 0.16  
DS  
HIGH dv/dt AND AVALANCHE CAPABILITIES  
100% AVALANCHE TESTED  
LOW INPUT CAPACITANCE AND GATE CHARGE  
LOW GATE INPUT RESISTANCE  
TO-220  
TO-220FP  
3
2
1
I²PAK  
(Tabless TO-220)  
DESCRIPTION  
The MDmesh™ is a new revolutionary MOSFET tech-  
nology that associates the Multiple Drain process with  
the Company’s PowerMESH™ horizontal layout. The  
resulting product has an outstanding low on-resis-  
tance, impressively high dv/dt and excellent avalanche  
characteristics. The adoption of the Company’s propri-  
etary strip technique yields overall dynamic perfor-  
mance that is significantly better than that of similar  
competition’s products.  
I
NTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
The MDmesh™ family is very suitable for increasing  
power density of high voltage converters allowing sys-  
tem miniaturization and higher efficiencies.  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
STP(B)22NM50(-1) STP22NM50FP  
V
Drain-source Voltage (V = 0)  
500  
500  
±30  
V
V
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
DGR  
GS  
V
Gate- source Voltage  
V
GS  
I
Drain Current (continuous) at T = 25°C  
20  
12.6  
80  
20(*)  
12.6(*)  
80(*)  
45  
A
D
C
I
Drain Current (continuous) at T = 100°C  
A
D
C
I
()  
Drain Current (pulsed)  
A
DM  
P
Total Dissipation at T = 25°C  
192  
1.2  
W
TOT  
C
Derating Factor  
0.36  
W/°C  
V/ns  
V
dv/dt(1)  
Peak Diode Recovery voltage slope  
Insulation Winthstand Voltage (DC)  
Storage Temperature  
15  
V
ISO  
--  
2000  
T
stg  
–65 to 150  
150  
°C  
°C  
T
Max. Operating Junction Temperature  
j
(•)Pulse width limited by safe operating area  
(1)I 20A, di/dt 400A/µs, V V  
, T T  
(BR)DSS j JMAX.  
SD  
DD  
(*)Limited only by maximum temperature allowed  
January 2003  
1/10  

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