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SST39SF040-70-4C-WHE PDF预览

SST39SF040-70-4C-WHE

更新时间: 2024-11-08 12:01:55
品牌 Logo 应用领域
美国微芯 - MICROCHIP 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
28页 273K
描述
1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose Flash

SST39SF040-70-4C-WHE 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:TSOP1
包装说明:TSSOP, TSSOP32,.56,20针数:32
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51Factory Lead Time:7 weeks
风险等级:2.03Is Samacsys:N
最长访问时间:70 ns命令用户界面:YES
数据轮询:YESJESD-30 代码:R-PDSO-G32
JESD-609代码:e3长度:12.4 mm
内存密度:4194304 bit内存集成电路类型:FLASH
内存宽度:8湿度敏感等级:3
功能数量:1部门数/规模:128
端子数量:32字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX8封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP32,.56,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:5 V编程电压:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
部门规模:4K最大待机电流:0.0001 A
子类别:Flash Memories最大压摆率:0.035 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40切换位:YES
类型:NOR TYPE宽度:8 mm
Base Number Matches:1

SST39SF040-70-4C-WHE 数据手册

 浏览型号SST39SF040-70-4C-WHE的Datasheet PDF文件第2页浏览型号SST39SF040-70-4C-WHE的Datasheet PDF文件第3页浏览型号SST39SF040-70-4C-WHE的Datasheet PDF文件第4页浏览型号SST39SF040-70-4C-WHE的Datasheet PDF文件第5页浏览型号SST39SF040-70-4C-WHE的Datasheet PDF文件第6页浏览型号SST39SF040-70-4C-WHE的Datasheet PDF文件第7页 
1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose Flash  
SST39SF010A / SST39SF020A / SST39SF040  
Data Sheet  
The SST39SF010A / SST39SF020A / SST39SF040 are CMOS Multi-Purpose  
Flash (MPF) devices manufactured with SST proprietary, high performance  
CMOS SuperFlash technology. The split-gate cell design and thick oxide tunnel-  
ing injector attain better reliability and manufacturability compared with alternate  
approaches. The SST39SF010A / SST39SF020A / SST39SF040 write (Program  
or Erase) with a 4.5-5.5V power supply, and conforms to JEDEC standard pinouts  
for x8 memories  
Features  
• Organized as 128K x8 / 256K x8 / 512K x8  
• Single 4.5-5.5V Read and Write Operations  
• Superior Reliability  
• Fast Erase and Byte-Program  
– Sector-Erase Time: 18 ms (typical)  
– Chip-Erase Time: 70 ms (typical)  
– Byte-Program Time: 14 µs (typical)  
– Chip Rewrite Time:  
2 seconds (typical) for SST39SF010A  
4 seconds (typical) for SST39SF020A  
8 seconds (typical) for SST39SF040  
– Endurance: 100,000 Cycles (typical)  
– Greater than 100 years Data Retention  
• Low Power Consumption  
(typical values at 14 MHz)  
• End-of-Write Detection  
– Active Current: 10 mA (typical)  
– Standby Current: 30 µA (typical)  
Toggle Bit  
– Data# Polling  
• Sector-Erase Capability  
• TTL I/O Compatibility  
– Uniform 4 KByte sectors  
• JEDEC Standard  
• Fast Read Access Time:  
– Flash EEPROM Pinouts and command sets  
– 55 ns  
– 70 ns  
• Packages Available  
– 32-lead PLCC  
– 32-lead TSOP (8mm x 14mm)  
– 32-pin PDIP  
• Latched Address and Data  
• Automatic Write Timing  
• All devices are RoHS compliant  
– Internal VPP Generation  
www.microchip.com  
©2013 Silicon Storage Technology, Inc.  
DS25022B  
04/13  

SST39SF040-70-4C-WHE 替代型号

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