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SST26WF040BA

更新时间: 2024-09-19 14:53:55
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美国微芯 - MICROCHIP /
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96页 2815K
描述
The SST26WF040B/040BA Serial Quad I/O (SQI) flash device utilizes a 4-bit multiplexed I/O serial i

SST26WF040BA 数据手册

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SST26WF040B/040BA  
SST26WF080B/080BA  
1.8V 4 Mbit and 8 Mbit Serial Quad I/O (SQI) Flash Memory  
• Security ID  
Features  
- One-Time Programmable (OTP) 2 KByte,  
Secure ID  
• Single Voltage Read and Write Operations  
- 1.65-1.95V  
- 64 bit unique, factory pre-programmed identifier  
- User-programmable area  
• Serial Interface Architecture  
Temperature Range  
- Mode 0 and Mode 3  
- Industrial: -40°C to +85°C  
• Packages Available  
- Nibble-wide multiplexed I/O’s with SPI-like serial  
command structure  
- x1/x2/x4 Serial Peripheral Interface (SPI) Protocol  
- 8-contact WDFN (6mm x 5mm)  
- 8-lead SOIC (150 mil)  
- 8-contact USON (2mm x 3mm)  
- 8-ball XFBGA (Z-Scale™)  
• High Speed Clock Frequency  
- 104 MHz max  
• Burst Modes  
• All devices are RoHS compliant  
- Continuous linear burst  
- 8/16/32/64 Byte linear burst with wrap-around  
Product Description  
• Superior Reliability  
- Endurance: 100,000 Cycles (min)  
- Greater than 100 years Data Retention  
The Serial Quad I/O™ (SQI™) family of flash-memory  
devices features a six-wire, 4-bit I/O interface that allows for  
low-power, high-performance operation in a low pin-count  
package. SST26WF040B/040BA and SST26WF080B/  
080BA also support full command-set compatibility to tradi-  
tional Serial Peripheral Interface (SPI) protocol. System  
designs using SQI flash devices occupy less board space  
and ultimately lower system costs.  
• Low Power Consumption:  
- Active Read current: 15 mA (typical @ 104 MHz)  
- Standby current: 10 µA (typical)  
- Deep Power-Down current: 1.8 µA (typical)  
• Fast Erase Time  
- Sector/Block Erase: 18 ms (typ), 25 ms (max)  
- Chip Erase: 35 ms (typ), 50 ms (max)  
All members of the 26 Series, SQI family are manufactured  
with proprietary, high-performance CMOS SuperFlash®  
technology. The split-gate cell design and thick-oxide tun-  
neling injector attain better reliability and manufacturability  
compared with alternate approaches.  
• Page-Program  
- 256 Bytes per page in x1 or x4 mode  
• End-of-Write Detection  
- Software polling the BUSY bit in status register  
• Flexible Erase Capability  
The SST26WF040B/040BA and SST26WF080B/  
080BA significantly improves performance and reliabil-  
ity, while lowering power consumption. This device  
writes (Program or Erase) with a single power supply of  
1.65-1.95V. The total energy consumed is a function of  
the applied voltage, current, and time of application.  
Since for any given voltage range, the SuperFlash  
technology uses less current to program and has a  
shorter erase time, the total energy consumed during  
any Erase or Program operation is less than alternative  
flash memory technologies.  
- Uniform 4 KByte sectors  
- Four 8 KByte top and bottom parameter overlay  
blocks  
- One 32 KByte top and bottom overlay block  
- Uniform 64 KByte overlay blocks  
• Write-Suspend  
- Suspend Program or Erase operation to access  
another block/sector  
• Software Reset (RST) mode  
• Software Write Protection  
SST26WF040B/040BA and SST26WF080B/080BA is  
offered in 8-contact WDFN (6 mm x 5 mm), 8-lead SOIC  
(150 mil), 8-contact USON, and 8-ball XFBGA (Z-Scale™)  
packages. See Figure 2-1 for pin assignments.  
- Individual-Block Write Protection with permanent  
lock-down capability  
- 64 KByte blocks, two 32 KByte blocks, and  
eight 8 KByte parameter blocks  
Two configurations are available upon order:  
SST26WF040B and SST26WF080B default at power-  
up has the WP# and Hold# pins enabled and  
SST26WF040BA and SST26WF080BA default at  
power-up has the WP# and Hold# pins disabled.  
- Read Protection on top and bottom 8 KByte  
parameter blocks  
2014-2017 Microchip Technology Inc.  
DS20005283C-page 1  

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