SSD40P04-20DE
-36A , -40V , RDS(ON) 30m
Ω
P-Ch Enhancement Mode Power MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen free
TO-252(D-Pack)
DESCRIPTION
These miniature surface mount MOSFETs utilize a
high cell density trench process to provide low RDS(on)
and to ensure minimal power loss and heat dissipation.
FEATURES
A
B
ꢀ
Low RDS(on) provides higher efficiency and
extends battery life.
C
D
ꢀ
Low thermal impedance copper leadframe
TO-252 saves board space.
G E
ꢀ
ꢀ
Fast Switch Speed.
High performance trench technology.
K
H F
N
O
P
M
J
APPLICATION
DC-DC converters and power management in portable
and battery-powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
Millimeter
Millimeter
REF.
REF.
Min.
Max.
Min.
Max.
A
B
C
D
E
F
6.35
5.20
2.15
0.45
6.8
6.80
5.50
2.40
0.58
7.5
J
K
M
N
O
P
2.30 REF.
0.64
0.50
0.9
0
0.43
0.90
1.1
1.65
0.15
0.58
PACKAGE INFORMATION
2.40
5.40
0.64
3.0
6.25
1.20
G
H
Package
MPQ
Leader Size
2
Drain
TO-252
2.5K
13 inch
1
Gate
3
Source
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)
Parameter
Symbol
VDS
Ratings
-40
Unit
Drain-Source Voltage
Gate-Source Voltage
V
V
VGS
±20
Continuous Drain Current 1
ID
IDM
-36
-40
A
2
Pulsed Drain Current @TA=25°C
A
Continuous Source Current (Diode Conduction) 1
IS
-30
A
1
Total Power Dissipation @TA=25°C
PD
50
W
°C
Operating Junction and Storage Temperature Range
TJ, TSTG
-55 ~ 175
Thermal Resistance Ratings
Maximum Thermal Resistance Junction-Ambient 1
RθJA
RθJC
50
3
°C / W
°C / W
Maximum Thermal Resistance Junction-Case
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
2-Dec-2011 Rev. A
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