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SN74LVC1G373DCK

更新时间： 2024-11-05 13:13:51
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德州仪器 - TI 锁存器
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SN74LVC1G373DCK 数据手册

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SCES528A − DECEMBER 2003 − REVISED JUNE 2004  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
D
Supports 5-V V  
Operation  
CC  
1
2
3
6
5
4
LE  
GND  
D
OE  
Inputs Accept Voltages to 5.5 V  
V
CC  
Max t of 4 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
24-mA Output Drive at 3.3 V  
Q
CC  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2 5  
1 6  
D
GND  
LE  
Q
Latch-Up Performance Exceeds 100 mA  
Per JESD 78, Class II  
V
CC  
OE  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This single D-type latch is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G373 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus  
drivers, and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs.  
When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.  
While the latch-enable (LE) input is high, the Q output follows the data (D) input. When LE is taken low, the Q  
output is latched at the logic level set up at the D input.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
OE does not affect the internal operations of the latch. Old data can be retained or new data can be entered  
while the outputs are in the high-impedance state.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74LVC1G373YEPR  
SN74LVC1G373YZPR  
Reel of 3000  
_ _ _D3_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G373DBVR  
SN74LVC1G373DBVT  
SN74LVC1G373DCKR  
SOT (SOT-23) − DBV  
CA3_  
D3_  
SOT (SC-70) − DCK  
Reel of 250  
SN74LVC1G373DCKT  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2004, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...13

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