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SN74LVC1G374_15

更新时间： 2024-09-15 02:58:15
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
13页 231K
描述
Single D-Type Flip-Flop With 3-State Output

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SN74LVC1G374_15 数据手册

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SCES520A − DECEMBER 2003 − REVISED JUNE 2004  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
D
Supports 5-V V  
Operation  
CC  
1
2
3
6
5
4
CLK  
GND  
D
OE  
Inputs Accept Voltages to 5.5 V  
V
CC  
Max t of 4 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
24-mA Output Drive at 3.3 V  
Q
CC  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2 5  
1 6  
D
GND  
CLK  
Q
Latch-Up Performance Exceeds 100 mA  
Per JESD 78, Class II  
V
CC  
OE  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This single D-type flip-flop is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G374 features a 3-state output designed specifically for driving highly capacitive or relatively  
low-impedance loads. This device is particularly suitable for implementing buffer registers, input/output (I/O)  
ports, bidirectional bus drivers, and working registers.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
On the positive transition of the clock (CLK) input, the Q output is set to the logic level set up at the data (D)  
input.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74LVC1G374YEPR  
SN74LVC1G374YZPR  
Reel of 3000  
_ _ _D4_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G374DBVR  
SN74LVC1G374DBVT  
SN74LVC1G374DCKR  
SOT (SOT-23) − DBV  
CA4_  
D4_  
SOT (SC-70) − DCK  
Reel of 250  
SN74LVC1G374DCKT  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2004, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...13

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