SN74LVC1G240
SINGLE BUFFER/DRIVER
WITH 3-STATE OUTPUT
www.ti.com
SCES305J–JANUARY 2001–REVISED JANUARY 2007
FEATURES
•
Available in the Texas Instruments
NanoFree™ Package
•
•
•
Ioff Supports Partial-Power-Down Mode
Operation
•
•
•
•
•
Supports 5-V VCC Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Inputs Accept Voltages to 5.5 V
Max tpd of 3.7 ns at 3.3 V
ESD Protection Exceeds JESD 22
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
3
2
1
4
5
GND
A
Y
VCC
1
2
3
5
4
OE
VCC
1
2
3
5
4
OE
A
A
VCC
OE
GND
Y
GND
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74LVC1G240YZPR
_ _ _CK_
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
SN74LVC1G240DBVR
SN74LVC1G240DBVT
SN74LVC1G240DCKR
SN74LVC1G240DCKT
C40_
CK_
–40°C to 85°C
SOT (SC-70) – DCK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.