ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢃ ꢊ
ꢀꢋ ꢁꢈ ꢄ ꢌ ꢍꢎꢏ ꢏ ꢌꢐ ꢑꢒ ꢐ ꢋꢅ ꢌ ꢐ
ꢓ ꢋꢔ ꢕ ꢖ ꢗꢀꢔꢘꢔ ꢌ ꢙ ꢎꢔ ꢚ ꢎꢔ
SCES305H − JANUARY 2001 − REVISED OCTOBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
D
Available in the Texas Instruments
NanoStar and NanoFree Packages
D
D
D
D
D
D
D
D
Supports 5-V V
Operation
CC
1
2
3
5
4
OE
A
GND
V
Y
CC
Inputs Accept Voltages to 5.5 V
Max t of 3.7 ns at 3.3 V
pd
Low Power Consumption, 10-µA Max I
CC
24-mA Output Drive at 3.3 V
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
I
Supports Partial-Power-Down Mode
off
Operation
3 4
2
GND
A
OE
Y
V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
1 5
CC
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This single buffer/driver is designed for 1.65-V to 5.5-V V
operation.
CC
The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
To ensure the high-impedance state during power up or power down, OE should be tied to V
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
through a pullup
CC
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC1G240YEAR
SN74LVC1G240YZAR
SN74LVC1G240YEPR
SN74LVC1G240YZPR
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
Reel of 3000
_ _ _CK_
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
Reel of 250
Reel of 3000
SN74LVC1G240DBVR
SN74LVC1G240DBVT
SN74LVC1G240DCKR
SOT (SOT-23) − DBV
SOT (SC-70) − DCK
C40_
CK_
Reel of 250
SN74LVC1G240DCKT
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
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